- Product Details
- {{item.text}}
Quick Details
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Place of Origin:
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Guangdong, China
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Brand Name:
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keyou
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Copper Thickness:
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0.5 OZ
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Min. Hole Size:
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0.2mm
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Min. Line Width:
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3mil
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Min. Line Spacing:
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3mil
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Surface Finishing:
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HASL/HASL lead free,HAL,Chemical tin, HASL/HASL lead free,HAL,Chemical tin,Chemical Gold
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Board Size:
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125*499 MM
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Product name:
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multilayer circuit boards pcb pcba
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Material:
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FR-4,CEM-3,High TG,FR4 Halogen Free,RIGID-FLEX
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Type:
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Multilayer Pcb
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Application:
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Electronics Device
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Position accuracy:
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40um
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Max Component Height:
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25mm
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Max PCB Width:
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450MM
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Shipping:
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DHL UPS EMS TNT FedEx
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OEM/ODM:
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Accepted
Quick Details
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Base Material:
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FR-4
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Board Thickness:
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0.20mm to 3.4mm
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Model Number:
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KY-RTS022
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Place of Origin:
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Guangdong, China
-
Brand Name:
-
keyou
-
Copper Thickness:
-
0.5 OZ
-
Min. Hole Size:
-
0.2mm
-
Min. Line Width:
-
3mil
-
Min. Line Spacing:
-
3mil
-
Surface Finishing:
-
HASL/HASL lead free,HAL,Chemical tin, HASL/HASL lead free,HAL,Chemical tin,Chemical Gold
-
Board Size:
-
125*499 MM
-
Product name:
-
multilayer circuit boards pcb pcba
-
Material:
-
FR-4,CEM-3,High TG,FR4 Halogen Free,RIGID-FLEX
-
Type:
-
Multilayer Pcb
-
Application:
-
Electronics Device
-
Position accuracy:
-
40um
-
Max Component Height:
-
25mm
-
Max PCB Width:
-
450MM
-
Shipping:
-
DHL UPS EMS TNT FedEx
-
OEM/ODM:
-
Accepted
Product Description
Electronic printed circuit board manufacturer assembly of electric pcb board
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Layer
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1 to 16 layers
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Material Type
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FR-4. CEM-3. High TG. FR4 Halogen Free, RIGID-FLEX
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Board Thickness
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0.20mm to 3.4mm
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Copper Thickness
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0.5 OZ to 6 OZ
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Copper Thickness in Hole
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>25.0 um(>1mi)
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Max Size of Finish Board
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700*460mm
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Min.Drilled Hole Size
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1.0mm
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Min.Line Width
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3mil
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Min.Line Spacing
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3mil
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Surface finishing
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HASL/HASL lead free,HAL,Chemical tin,Chemical Gold,
Immersion Silver/Gold,OSP,Gold plating |
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Solder Mask Color
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Green/Yellow/Black/White/Red/Blue
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Shape tolerance
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±4mil
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Hole tolerance
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PTH:±3mil,NPTH:±2mil
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Package
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Inner paking/Plastic bag,Outer packing:Standard
carton packing |
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Certificate
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UL,SGS, ISO 9001:2008,IATF16949
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Special requirements
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Buried and blind vias+controlled impedance+BGA
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Profiling
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Punching,Routing, V-CUT,Beveling
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