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Glue High Temperature And Waterproof Insulation Epoxy Resin For LedGlue Ab  Encapsulation  Potting Glue For Electronic
Glue High Temperature And Waterproof Insulation Epoxy Resin For LedGlue Ab  Encapsulation  Potting Glue For Electronic
Glue High Temperature And Waterproof Insulation Epoxy Resin For LedGlue Ab  Encapsulation  Potting Glue For Electronic
Glue High Temperature And Waterproof Insulation Epoxy Resin For LedGlue Ab  Encapsulation  Potting Glue For Electronic
Glue High Temperature And Waterproof Insulation Epoxy Resin For LedGlue Ab  Encapsulation  Potting Glue For Electronic
Glue High Temperature And Waterproof Insulation Epoxy Resin For LedGlue Ab  Encapsulation  Potting Glue For Electronic
Glue High Temperature And Waterproof Insulation Epoxy Resin For LedGlue Ab  Encapsulation  Potting Glue For Electronic
Glue High Temperature And Waterproof Insulation Epoxy Resin For LedGlue Ab  Encapsulation  Potting Glue For Electronic

Glue High Temperature And Waterproof Insulation Epoxy Resin For LedGlue Ab Encapsulation Potting Glue For Electronic

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≥20 Kilograms
US $7.2
≥100 Kilograms
US $6.94
≥1000 Kilograms
US $6.77
≥10000 Kilograms
US $6.45
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Quick Details

EINECS No.:
231-545-4
Place of Origin:
Guangdong, China
Brand Name:
Boqiao
Model Number:
YH1145AB
Type:
Two Component
Product name:
Potting Glue For Electronic
Application:
Sealing Construction
Keywords:
electronic potting glue
Viscosity:
40000-45000
Advantage:
Suitable High Temperate Climates
Color:
Transparent
Material:
Pure Epoxy
MOQ:
1 KG
Certificate:
rohs
Packing:
Bottle

Quick Details

CAS No.:
67763-03-05
Other Names:
epoxy resin and hardener
MF:
mSiO2 nH2O
EINECS No.:
231-545-4
Place of Origin:
Guangdong, China
Brand Name:
Boqiao
Model Number:
YH1145AB
Type:
Two Component
Product name:
Potting Glue For Electronic
Application:
Sealing Construction
Keywords:
electronic potting glue
Viscosity:
40000-45000
Advantage:
Suitable High Temperate Climates
Color:
Transparent
Material:
Pure Epoxy
MOQ:
1 KG
Certificate:
rohs
Packing:
Bottle

Product Description

BEFORE YOU BUY

NOTE!!!!!!

Before you place order, please contact me to confirm shipping cost!

Before Curing:

Items

Units/conditions

Part A

Part B

Viscosity

(mpa.s) 25℃

12000~14000mpa.s

100~300mpa.s

Density

g/cm 3 25℃

1.75

1.13

Ratio

weight

3

1

volume

2.5

1

Operative time

M ins at 25℃

150g

30-45mins

gel time

25℃

2-4 hrs

C uring time

25℃

24-48 hrs

80

1 hr

L ife span

12 months

After Curing:

Items

Units/conditions

Technical Data

Viscosity

Shore-D

80-85

Volume resistivity

25℃/ Ω./ cm

>1.4x10 15

Surface resistivity

25℃/ Ω.

>1.2x10 14

Dielectric strength

25℃ KV/MM

4.80-5.30

Coefficient of linear expansion

CM/K

<6.1x10 -5

Glass transition temperature

>90

Temperature resistant

-60 ~ 120


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