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Conduction Paint Paste Silver Conductive Adhesive Glue for PCB Repair Welding Tool OEM
Conduction Paint Paste Silver Conductive Adhesive Glue for PCB Repair Welding Tool OEM
Conduction Paint Paste Silver Conductive Adhesive Glue for PCB Repair Welding Tool OEM
Conduction Paint Paste Silver Conductive Adhesive Glue for PCB Repair Welding Tool OEM
Conduction Paint Paste Silver Conductive Adhesive Glue for PCB Repair Welding Tool OEM
Conduction Paint Paste Silver Conductive Adhesive Glue for PCB Repair Welding Tool OEM
Conduction Paint Paste Silver Conductive Adhesive Glue for PCB Repair Welding Tool OEM
Conduction Paint Paste Silver Conductive Adhesive Glue for PCB Repair Welding Tool OEM

Conduction Paint Paste Silver Conductive Adhesive Glue for PCB Repair Welding Tool OEM

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≥1 Pieces
US $12.85
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Quick Details

Type:
Liquid glue
Product name:
Conductive Silver Adhesive
Capacity:
10ml, 30ml, 500g, 1kg

Quick Details

Place of Origin:
Guangdong, China
Brand Name:
Dingtai
Model Number:
DTS9155
Type:
Liquid glue
Product name:
Conductive Silver Adhesive
Capacity:
10ml, 30ml, 500g, 1kg
Products Description
Conductive Silver Adhesive
Item
Performance
parameter
Test condition
Test method
Pre-cure
Characteristic
Density
3.5g/cc
/
Viscosity (25℃)
10000cPs
Brookfield
CP51@50rpm
ATM-0018
Thixotropic index
5.1
stickiness@0.5/ @5rpm
ATM-0089
Operating time (25℃)
18hrs
Physical service life
of the filler
ATM-0067
Post-cure
Characteristic
Thermal conductivity
2.5W/m^K
Laser radiation
ATM-00211
Volume resistivity
0.00015ohm-cm
4 Point detection
resistance meter
ATM-00412
Chip shear strength (25℃)
15kg/die
2x2mm(80x80mil)
Silicon chip
ATM-005218
Shear strength of aluminum
sheet (25℃)
10 Mpa
20x12.5mm
ATM-B209
Product Overview
DTS9155 conductive silver adhesive is a single component, low viscosity conductive silver adhesive. Good rheological property, suitable for high-speed chip bonding package, high purity, widely used in semiconductor industry, chip paste, suitable for high-speed dispensing of fully automatic machines
Product Feature
1.high conductivity.
2.box oven curing.
3.Excellent dispensing properties, minimize tailing and wire drawing
Product Application
Semiconductor components, chip bonding, communication base stations, mobile phones and other smart electronic products, computer hardware.
Using Technology
 Thawing;
1. Allow the container to come to room temperature before use. Once removed from the freezer, place the needle vertically for thawing.
2. Do not open the container until the contents have reached room temperature. Remove moisture from the defrosted container before opening the container.
3. Do not refreeze, once thawed to room temperature, glue cannot be refrozen.
 Application:
1. The thawed glue must be immediately placed on the dispensing equipment for use, if the glue is transferred to the final dispensing storage, it must avoid contamination or air entering the glue, and the glue must be used within 18 hours. If the glue is left in an environment that does not meet the service life, silver and resin separation will occur.
2. Use sufficient amount of glue to achieve 25~50nm (1~2mil) wet bonding surface thickness, allocate about 25%~50% glue around the seal.
【Cautions】
Curing process: 3~5℃/ min heating up to 175℃+1 hour @175℃, this temperature curing reduces the bonding surface temperature, let the solvent volatilize and increase the strength.
【Storage Environment & Expiration & Packaging】
 Storage environment: In -40℃ environment, storage conditions are consistent, DTS9155 adhesive can be stored for 1 year. Allow storage conditions to vary as follows:
1. Storage temp.(0℃~+5℃): syringe package 8 days shelf life ; can package 1month shelf life.
2. Storage temp.(-15℃~-10℃): syringe package 2 months shelf life ; can package 6 months shelf life.
 Expiration:6 Months.
 Packing specifications: 10ml/ pcs, 30ml/ p, 500g/ can, 1kg/ can.
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