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IC Chip Memory Electronic Component Tray Plastic Molding New and Original Company Electronics Packaging Customized Function
IC Chip Memory Electronic Component Tray Plastic Molding New and Original Company Electronics Packaging Customized Function
IC Chip Memory Electronic Component Tray Plastic Molding New and Original Company Electronics Packaging Customized Function
IC Chip Memory Electronic Component Tray Plastic Molding New and Original Company Electronics Packaging Customized Function
IC Chip Memory Electronic Component Tray Plastic Molding New and Original Company Electronics Packaging Customized Function
IC Chip Memory Electronic Component Tray Plastic Molding New and Original Company Electronics Packaging Customized Function
IC Chip Memory Electronic Component Tray Plastic Molding New and Original Company Electronics Packaging Customized Function
IC Chip Memory Electronic Component Tray Plastic Molding New and Original Company Electronics Packaging Customized Function

IC Chip Memory Electronic Component Tray Plastic Molding New and Original Company Electronics Packaging Customized Function

FOB Reference Price: Get Latest Price
≥1000 Pieces
US $0.99
≥5000 Pieces
US $0.98
≥10000 Pieces
US $0.95
≥50000 Pieces
US $0.91
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Quick Details

Model Number:
JEDEC TRAY
Product:
Electronics Packaging
Industrial Use:
Electronics Packaging
Processing Type:
Plastic Injection
Material:
PP/PP0/ABS/LCP/PPE/PS/ABS+PC
Surface Resistant:
10e4-10e9ohms
Standard:
JEDEC/EIAJ Standard
High Temperature Resistance:
80°/120°/150°/270°
Suitable IC packaging type:
QFN/BGA/QFP/SOP
Suitable IC packaging size:
Customized
Certificates:
ESD& RoHS environmental Tests
Function:
Function

Quick Details

Shaping Mode:
Plastic Injection Mould
Place of Origin:
Shanghai, China
Brand Name:
GUXIANG
Model Number:
JEDEC TRAY
Product:
Electronics Packaging
Industrial Use:
Electronics Packaging
Processing Type:
Plastic Injection
Material:
PP/PP0/ABS/LCP/PPE/PS/ABS+PC
Surface Resistant:
10e4-10e9ohms
Standard:
JEDEC/EIAJ Standard
High Temperature Resistance:
80°/120°/150°/270°
Suitable IC packaging type:
QFN/BGA/QFP/SOP
Suitable IC packaging size:
Customized
Certificates:
ESD& RoHS environmental Tests
Function:
Function

Product Description

Product name IC tray for Electronic parts packaging
Materials PP PP0 ABS LCP PPE PS ABS+PC
Dimension Based on each model orcustomized
advantage High temperature resistant 80°/120°/150°/270°
IC tray Application

we provide IC trays for semi conductor&electronic components packaging with JEDEC standard as well as Wafer, chip trays and the other irregular customized trays for kinds of precise parts

Design requirement Can be customized according to user requirements of various specifications, sizes, can be equipped with cover, dustproof, anti-static, beautiful appearance
Design criteria In line with JEDEC international standards, strong versatility.

Customized high temperature resistant IC trays: 80°/120°/150° /270° materials

Q1: Are you a trading company or a manufacturer?

Reply: We are really the original manufacturer with the experience of 15 years, we are dedicated to the integrated service about designing shape,producing moulds, injection processing,printing,coating and products assembling; Besides, we also provide automatic solutions and applications for enterprises. We have more than 20 years experience s technicians and 100+staff and 2000 square meters workshop.

Q2: How to get the quotation?

Reply: we will provide the quotation within 24 hours, in order to give an exact and instant quotation, please provide details as below:

1) documents and drawings

2) material requirement

3) specifications

4) quantity

5) the other requirement

Q3: If we donot have any drawings, how to do?

Reply:we can provide free design for you, or you send your samples to our factor, then we can duplicate or provide better solution for you.

Q4: How long to open a mould?

Reply: sample-mould:10-12days.

soft-mould:15days.

hard-mould:20days

hard-mould (>200T)25-28 days

2 colors production-mould:25-28 days

It depends on the requirements and complexity.

Q5: what kind of services that we can provide?

1.OEM/ODM service

2.Professional service for moulding design and production

3.provide service for plastic parts/printing/coating assembling

4.provide service for plastic parts assembling

5.provide packaging service for plastic parts

6.provide after-sale service

Q6:How many kinds of plastic injection products you produce?

Reply: mainly for consumer electronics,medical facilities,auto parts,digital electronics,computer accessories,semi conductor, labor protection and the other products, welcome to enquiry!

Q7:How about your factory certificates?

Reply: ISO9001 ITF16949 ISO14001 SGS,ROHS,TUV,CE,etc.

Q8:Which kind your mould products?

Reply: plastic injection mould, plastic injection products.

Q9: How many kinds of materials for chip trays?

Reply:ABS/PPO/PPE/LCP/PS /PC, temperature resistant range 80,120,150,270°,we are able to design different kinds of temperature resistant and anti-static trays.

Q10: Which kinds of  trays that you produce?

Reply: we provide IC trays for semi conductor&electronic components packaging with JEDEC standard as well as Wafer, chip trays and the other irregular customized trays for kinds of precise parts.

Q11:How about the packaging type for your trays?

Reply: BGA,QFN,QFP,BGA,TQFP,LQFP,SO,TSOP,PLCC,LC,etc multiple different kinds of packaging type.

Please kindly inform us your exact requirements, or leave your contacting information, we will contact with you in the first time!

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