(1) Easy peel off no glue residue;
(2) Heat resistance,solvent resistant, stable and reliable;
(3) H-class insulation,superior electrical insulation performance;
(4) Powder coating,glass sandblasting,paint spray,ordinary surface protection;
(5) Strong tensile strength,high strength backing,superior resistance to puncture and tear;
(6) High performance Silicone Adhesive,Polyimide film with good abrasion and chemical, acid, alkali resistance.
- Product Details
- {{item.text}}
Quick Details
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Design Printing:
-
No printing
-
Material:
-
Polyimide
-
Feature:
-
Heat-Resistant
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Use:
-
MASKING
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Place of Origin:
-
Guangdong, China
-
Brand Name:
-
TCF PACK
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Model Number:
-
TCF-K10
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Name:
-
PI Film Adhesive Tape
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Size:
-
50mic*10mm*33m
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Color:
-
golden
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Keywords:
-
sublimation tape
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Application:
-
Electrical insulation, masking, pcb, smt
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MOQ:
-
50rolls
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Sample:
-
Freely
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Glue:
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silicone
Quick Details
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Adhesive:
-
Silicone
-
Adhesive Side:
-
Single Sided
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Adhesive Type:
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Pressure Sensitive
-
Design Printing:
-
No printing
-
Material:
-
Polyimide
-
Feature:
-
Heat-Resistant
-
Use:
-
MASKING
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
TCF PACK
-
Model Number:
-
TCF-K10
-
Name:
-
PI Film Adhesive Tape
-
Size:
-
50mic*10mm*33m
-
Color:
-
golden
-
Keywords:
-
sublimation tape
-
Application:
-
Electrical insulation, masking, pcb, smt
-
MOQ:
-
50rolls
-
Sample:
-
Freely
-
Glue:
-
silicone
Product Description
TCF PACK Sublimation Heat Resistant Tape
is made of Polyimide Film and silicone glue, which can resist heat 500F half an hour, and left no trance. Its widely used in electronic products, soldering
and circuit boards, etching, fiber optics cable, insulating circuit boards, manufacturing semiconductor, high temp powder coating etc.
and circuit boards, etching, fiber optics cable, insulating circuit boards, manufacturing semiconductor, high temp powder coating etc.
Feature
Detailed Images
-
Diamenter: 9.3cm
Width:10mm
Leave no residue
Manufacture Specification
|
Product Name
|
Polyimide Sublimation Tape
|
|
|
||
|
Item
|
Unit
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SPEC
|
Test Method
|
||
|
Total Thickness
|
mm
|
0.05±0.005
|
GB7125-1999
|
||
|
Film Thcikness
|
mm
|
0.025
|
GB7125-1999
|
||
|
Adhesion
|
N/25mm
|
≥4
|
GB/T72792-1998
|
||
|
Tensile Strength
|
N/25mm
|
85
|
GB7753-1987
|
||
|
Elongation
|
％
|
50
|
GB7753-1987
|
||
|
Insulation Class
|
|
H Class
|
|
||
|
Heat Resistance
|
℃
|
260 ℃ half an hour
|
|
||
(2) Fiber optics cable,insulation protection for electrical devices,circuit boards,motor insulation;
(3) Automotive sensor and manifolds,the fixation of heaters,semiconductor manufacturing,Lithium battery packing;
Insulation protection in electronics industry;
(4) Heat resistant,can endure high temperature up to 260 °C(500°F) within half an hour,suit for sheet or roll material or diecutprocessing,etching,protection of gold finger of the PCB under wave soldering.
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