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grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics
grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics
grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics
grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics

grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics

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US $3100
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Quick Details

Weight (KG):
70
Applicable Industries:
Lab
Product name:
Auto Lapping/Polishing Machine

Quick Details

Place of Origin:
Henan, China
Brand Name:
TCH
Power (kW):
3
Weight (KG):
70
Applicable Industries:
Lab
Product name:
Auto Lapping/Polishing Machine

grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics

Product Description

UNIPOL-1202 machine is equipped with 12" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" in diameter . It can be used as a standard grinding and polishing machine for preparing metallographic samples as well

Specification of the grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics

Power

AC 208-240V (50/60Hz) switchable for worldwide operation.

Features
  • One cast-iron plate for lapping and one cast aluminum plate for polishing
  • Two rocking workstations with wafer holders and condition rings, which can be controlled independently for polishing 2 pcs of 4" wafers at the same time
  • Complete accessories are included for immediate use
Super-Flat 12" (300 mm) Diameter Lapping Plate Flatness < 0.25 micron / inch²
Precision Rotating Plate Run-off < 5 micron
Heavy Duty Cast Aluminum Case with Bright Painting Color: Black or White
Two Work Stations with 8° Rocking and adjustable speed 8" rocking with 0- 9 rocking/minute adjustable
Flat Sample Holders Two Flat Holders: 105 Dia. x 35 T mm,  which can carry  2 samples up to 4" diameter
Condition Rings Two condition rings: 120 O.D. x 110 I.D. x 32 T mm, which ensures the polished surface flat
Variable Speed of Master Plate with Digital Display 0 ~ 125 rpm
Adjustable Timer for Auto-Stop 0 - 99 hours
Motor 300 W high torque DC motor
Dimensions 700 L x 475 W x 300 H (mm)
Weight 154 lbs
Optional Automatic Slurry Feeder Automatic slurry feeder SKZD-2 is optional.
The plastic rolling container can take the volume of slurry up to 1.0 Gallon (~3.8L) for long time polishing.

Dimensions of shipment 40" x 30" x 26"
Weight of shipment 245 lbs

Optional Parts
Compliance
  • CE Certified

Warranty
  • One year limited with lifetime support
  • Rusting and damage due to improper storage condition or maintenance is not covered by warranty

reference of the grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics

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