- Product Details
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Quick Details
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Weight (KG):
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70
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Applicable Industries:
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Lab
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Product name:
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Auto Lapping/Polishing Machine
Quick Details
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Place of Origin:
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Henan, China
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Brand Name:
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TCH
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Power (kW):
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3
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Weight (KG):
-
70
-
Applicable Industries:
-
Lab
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Product name:
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Auto Lapping/Polishing Machine
grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics
UNIPOL-1202 machine is equipped with 12" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" in diameter . It can be used as a standard grinding and polishing machine for preparing metallographic samples as well
Specification of the grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics
Power |
AC 208-240V (50/60Hz) switchable for worldwide operation. |
Features |
|
Super-Flat 12" (300 mm) Diameter Lapping Plate | Flatness < 0.25 micron / inch² |
Precision Rotating Plate Run-off | < 5 micron |
Heavy Duty Cast Aluminum Case with Bright Painting | Color: Black or White |
Two Work Stations with 8° Rocking and adjustable speed | 8" rocking with 0- 9 rocking/minute adjustable |
Flat Sample Holders | Two Flat Holders: 105 Dia. x 35 T mm, which can carry 2 samples up to 4" diameter |
Condition Rings | Two condition rings: 120 O.D. x 110 I.D. x 32 T mm, which ensures the polished surface flat |
Variable Speed of Master Plate with Digital Display | 0 ~ 125 rpm |
Adjustable Timer for Auto-Stop | 0 - 99 hours |
Motor | 300 W high torque DC motor |
Dimensions | 700 L x 475 W x 300 H (mm) |
Weight | 154 lbs |
Optional Automatic Slurry Feeder |
Automatic slurry feeder SKZD-2
is
optional.
The plastic rolling container can take the volume of slurry up to 1.0 Gallon (~3.8L) for long time polishing. |
Dimensions of shipment | 40" x 30" x 26" |
Weight of shipment | 245 lbs |
Optional Parts |
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Compliance |
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Warranty |
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reference of the grinding and polishing machine for metallographic samples like crystal components, semiconductor wafers, and and ceramics
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