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22.5W power Bank 5-port bidirectional fast charge mobile power module Circuit board diy motherboard  QC4+PD3.0 kit
22.5W power Bank 5-port bidirectional fast charge mobile power module Circuit board diy motherboard  QC4+PD3.0 kit
22.5W power Bank 5-port bidirectional fast charge mobile power module Circuit board diy motherboard  QC4+PD3.0 kit
22.5W power Bank 5-port bidirectional fast charge mobile power module Circuit board diy motherboard  QC4+PD3.0 kit
22.5W power Bank 5-port bidirectional fast charge mobile power module Circuit board diy motherboard  QC4+PD3.0 kit
22.5W power Bank 5-port bidirectional fast charge mobile power module Circuit board diy motherboard  QC4+PD3.0 kit
22.5W power Bank 5-port bidirectional fast charge mobile power module Circuit board diy motherboard  QC4+PD3.0 kit
22.5W power Bank 5-port bidirectional fast charge mobile power module Circuit board diy motherboard  QC4+PD3.0 kit

22.5W power Bank 5-port bidirectional fast charge mobile power module Circuit board diy motherboard QC4+PD3.0 kit

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≥5 Pieces
US $4
≥30 Pieces
US $3.9
≥50 Pieces
US $3.8
≥100 Pieces
US $3.7
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Quick Details

Supplier Type:
manufacture
Copper Thickness:
0.5oZ-12oZ
Substrate Material:
FR-4/High TGFR-4/Halogen-free material/Polytetrafluoroethylene/FPC
copper thickness:
0.5oZ-12oZ
plate thickness:
0.2mm-7.0mm
Minimum Hole Diameter:
0.1mm
Minimum Line Width:
0.075mm
Minimum Line Distance:
0.075mm
surface treatment:
HASL,ENIG,OSP
Product Certificates:
ISO9001/Iso14001/CE/ROHS/UL/TF16949

Quick Details

Model Number:
QC4+PD3.0
Place of Origin:
China
Brand Name:
oem
Supplier Type:
manufacture
Copper Thickness:
0.5oZ-12oZ
Substrate Material:
FR-4/High TGFR-4/Halogen-free material/Polytetrafluoroethylene/FPC
copper thickness:
0.5oZ-12oZ
plate thickness:
0.2mm-7.0mm
Minimum Hole Diameter:
0.1mm
Minimum Line Width:
0.075mm
Minimum Line Distance:
0.075mm
surface treatment:
HASL,ENIG,OSP
Product Certificates:
ISO9001/Iso14001/CE/ROHS/UL/TF16949
Specification
Model Number
QC4+PD3.0
Type
motherboard pcba
Place of Origin
China
Brand Name
oem
Supplier Type
manufacture
Copper Thickness
0.5oZ-12oZ
Substrate Material
FR-4/High TGFR-4/Halogen-free material/Polytetrafluoroethylene/FPC
copper thickness
0.5oZ-12oZ
plate thickness
0.2mm-7.0mm
Minimum Hole Diameter
0.1mm
Minimum Line Width
0.075mm
Minimum Line Distance
0.075mm
surface treatment
HASL,ENIG,OSP
Product Certificates
ISO9001/Iso14001/CE/ROHS/UL/TF16949
Packing & Delivery
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