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Free Sample Cpu Electronic Chip Special Adhesive Glue Rubber Gel Heat Dissipation Bonding insulating potting glue
Free Sample Cpu Electronic Chip Special Adhesive Glue Rubber Gel Heat Dissipation Bonding insulating potting glue
Free Sample Cpu Electronic Chip Special Adhesive Glue Rubber Gel Heat Dissipation Bonding insulating potting glue
Free Sample Cpu Electronic Chip Special Adhesive Glue Rubber Gel Heat Dissipation Bonding insulating potting glue
Free Sample Cpu Electronic Chip Special Adhesive Glue Rubber Gel Heat Dissipation Bonding insulating potting glue
Free Sample Cpu Electronic Chip Special Adhesive Glue Rubber Gel Heat Dissipation Bonding insulating potting glue
Free Sample Cpu Electronic Chip Special Adhesive Glue Rubber Gel Heat Dissipation Bonding insulating potting glue
Free Sample Cpu Electronic Chip Special Adhesive Glue Rubber Gel Heat Dissipation Bonding insulating potting glue

Free Sample Cpu Electronic Chip Special Adhesive Glue Rubber Gel Heat Dissipation Bonding insulating potting glue

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≥1 Kilograms
US $4.3
≥100 Kilograms
US $3.85
≥1000 Kilograms
US $3.54
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Quick Details

EINECS No.:
231-545-4
Place of Origin:
Guangdong, China
Brand Name:
Boqiao, Boqiao
Model Number:
YH9012AB, YH9012AB
Type:
Two Component, Two Component
Product name:
Potting Glue For Electronic
Keywords:
electronic potting glue
Viscosity:
40000-45000
Advantage:
Suitable High Temperate Climates
MOQ:
1 KG
Material:
Pure Epoxy
Packing:
Bottle

Quick Details

CAS No.:
67763-03-05
Other Names:
epoxy resin and hardener
MF:
mSiO2 nH2O
EINECS No.:
231-545-4
Place of Origin:
Guangdong, China
Brand Name:
Boqiao, Boqiao
Model Number:
YH9012AB, YH9012AB
Type:
Two Component, Two Component
Product name:
Potting Glue For Electronic
Keywords:
electronic potting glue
Viscosity:
40000-45000
Advantage:
Suitable High Temperate Climates
MOQ:
1 KG
Material:
Pure Epoxy
Packing:
Bottle
BEFORE YOU BUY
NOTE!!!!!!
Before you place order, please contact me to confirm shipping cost!
CHARACTERISTICS
UL certificate No. -E513688
YH-9012A / B is two-component epoxy resin with low viscosity, good fluidity and good leveling. It has following characteristics:
1. Transparent: black liquid.
2. It’s low viscosity, good fluidity and easily penetrate into the product gap;
3. It Can be cured at room temperature 25℃ or medium temperature
4. After curing, It’s high hardness, high gloss like crystal, and we can see the surface is smooth and no bubbles.
PRODUCT RANGE
1. Widely used for transformers, sensors, buzzers, atomizers, negative ion generators, aquarium water pumps, ignition coils, power modules, electronic controllers and other electronic components;
2. Other products that require infusion sealing, packaging protection, insulation and moisture resistance.
TECHNICAL DATA
ITEM
CONDITIONS
YH-9012A
YH-9012B
Transparent
--
Black liquid
Brown liquid
density
25℃,g/cm3
1.72~1.82
1.15~1.25
viscosity
25℃,mPa.s
8000~12000
80~160
ITEM
CONDITIONS
DATA
Mixing ratio(A:B)
Weight Ratio
5:1
Mixed Viscosity
25℃
1600-2000mpa.s
ITEM
CONDITIONS
DATA
Hardness
SHORE-D
80±3
Volume resistivity
25℃,Ω.cm
>1.35×10 15
Surface resistivity
25℃,Ω
>1.2×10 14
Dielectric strength
25℃,Kv/mm
>25
Dielectric constant(50Hz)
4.80-5.30
Dielectric loss
0.03-0.05
Tensile Strength
MPa
20-30
Bending strength
MPa
65-75
Impact strength
KJ/m2
25-40
Glass transition temperature
°C
80-90
Shelf life
6 months
Note: The above performance data is for customers' reference only, and cannot guarantee that all the above values can be reached in a specific environment. Please refer to the actual measured data when conducting.
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