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YIHUA 938BD+-I 750W Soldering Iron Station Declined Display SMD Rework Station LCD Welding Station Hot Air Gun Soldering Station
YIHUA 938BD+-I 750W Soldering Iron Station Declined Display SMD Rework Station LCD Welding Station Hot Air Gun Soldering Station
YIHUA 938BD+-I 750W Soldering Iron Station Declined Display SMD Rework Station LCD Welding Station Hot Air Gun Soldering Station
YIHUA 938BD+-I 750W Soldering Iron Station Declined Display SMD Rework Station LCD Welding Station Hot Air Gun Soldering Station
YIHUA 938BD+-I 750W Soldering Iron Station Declined Display SMD Rework Station LCD Welding Station Hot Air Gun Soldering Station
YIHUA 938BD+-I 750W Soldering Iron Station Declined Display SMD Rework Station LCD Welding Station Hot Air Gun Soldering Station
YIHUA 938BD+-I 750W Soldering Iron Station Declined Display SMD Rework Station LCD Welding Station Hot Air Gun Soldering Station
YIHUA 938BD+-I 750W Soldering Iron Station Declined Display SMD Rework Station LCD Welding Station Hot Air Gun Soldering Station

YIHUA 938BD+-I 750W Soldering Iron Station Declined Display SMD Rework Station LCD Welding Station Hot Air Gun Soldering Station

FOB Reference Price: Get Latest Price
≥1 Pieces
US $79
≥50 Pieces
US $69
≥100 Pieces
US $59
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Quick Details

Quick Details

Place of Origin:
Guangdong, China
Weight (KG):
6 KG
Features
Inclined Panel,More suitable for your work angle
Pluggable Type,Convenient to change
Embedded Interface,Good for safe
High power soldering iron
Intelligent Temp.Correction,More accurate temperature for your soldering
°C/°F temp .Mode
No Operation 10 mins Start Sleep
Sound of press Button
Machine Data
Rated voltage  240V/230V/220V/110V ±10% 50Hz/60Hz
Whole device power ≤750W
Work environment: 0~40°C
Storage temperature:  -20~80°C
Storage Humidity: 35%~45%
Hot air gun part
Temperature range: 100°C~480
Temperature stability: ±2°C(Static state)
Airflow type: Brushless fan gentle wind
Airflow: 120L/min (MAX)
Soldering iron part
power: 60W
Work voltage: 26V±10% 50Hz/60
Temperature range: 200°C~480°C
Temperature stability: ±2°C (Static state)
Tip-to-ground impedance:  <2Ω
Tip-to-ground voltage: <2mV
Application
1. Suitable for a variety of elements soldering and de-soldering such as SOIC, CHIP, QFP, PLCC, BGA (especially suitable for mobile phone board and cable de-soldering).
2. For thermal shrinkage, drying, paint, adhesive removal, thawing, preheating,  welding glued.

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