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Potting Compound AB Glue 3M DP270 Epoxy Resin Structural Adhesive Electronic Component Encapsulation
Potting Compound AB Glue 3M DP270 Epoxy Resin Structural Adhesive Electronic Component Encapsulation
Potting Compound AB Glue 3M DP270 Epoxy Resin Structural Adhesive Electronic Component Encapsulation
Potting Compound AB Glue 3M DP270 Epoxy Resin Structural Adhesive Electronic Component Encapsulation
Potting Compound AB Glue 3M DP270 Epoxy Resin Structural Adhesive Electronic Component Encapsulation
Potting Compound AB Glue 3M DP270 Epoxy Resin Structural Adhesive Electronic Component Encapsulation
Potting Compound AB Glue 3M DP270 Epoxy Resin Structural Adhesive Electronic Component Encapsulation
Potting Compound AB Glue 3M DP270 Epoxy Resin Structural Adhesive Electronic Component Encapsulation

Potting Compound AB Glue 3M DP270 Epoxy Resin Structural Adhesive Electronic Component Encapsulation

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≥12 Pieces
US $12
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Quick Details

EINECS No.:
None
Place of Origin:
Guangdong, China
Brand Name:
3M
Model Number:
DP270
Type:
Gel
Product Name:
Epoxy Potting Compound 3M DP270
Advantage:
Non-corrosive to copper
Application:
Electronic Industry
Work Life:
70min.
Mix Ratio:
1:1
MOQ:
1pcs
Color:
Clear, Black
Volume:
48.5mL
Package:
12pcs/carton
Feature:
Flame retardant

Quick Details

CAS No.:
None
Other Names:
None
MF:
None
EINECS No.:
None
Place of Origin:
Guangdong, China
Brand Name:
3M
Model Number:
DP270
Type:
Gel
Product Name:
Epoxy Potting Compound 3M DP270
Advantage:
Non-corrosive to copper
Application:
Electronic Industry
Work Life:
70min.
Mix Ratio:
1:1
MOQ:
1pcs
Color:
Clear, Black
Volume:
48.5mL
Package:
12pcs/carton
Feature:
Flame retardant
Products Description
3M Epoxy Potting Compound DP270
I s a rigid, two-part epoxy adhesive with a 1:1 mix ratio .
■ Features a 70 minute work life .
■ Rigid potting compound is non-corrosive to copper .
■ Minimal exotherm and very low shrinkage .
■ Low viscosity for easy dispensing and potting . ■ Flammability testing per UL94 HB .
Specifications
Brand
3M
Product No.
DP270
Product Type
AB Structural Adhesive
Color
Black/Clear
Mix Ratio
1:1
Work Life
70 minutes
Overlap Shear at 24°C
17 Mpa
Key Features
Rigid potting compound non-corrosive
Details Images
Applications
Potting Compound 3M DP270
Well-suited for potting and bonding electronic and electrical components.
■ Potting and bonding electrical components
■ Ideal for the potting and encapsulation of many heat sensitive or delicate components such as glass diodes and sensors as well as for transformers, coils, chokes, relays, etc.
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