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Quick Details
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China:
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Guangdong
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color:
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Green,Blue on your request
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Metrials:
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FR-4,Aluminum,CEM-1 etc
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Certificate:
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CE,ROHS,SGS etc
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OEM/ODM:
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Support
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MOQ:
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1 PC
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Copper thickness:
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0.25OZ~12OZ
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Silkscreen color:
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White or on your request.
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Copper Thickness:
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1oz
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Board Thickness:
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0.2-6.0mm
Quick Details
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Model Number:
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009
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Place of Origin:
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Guangdong, China
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Supplier Type:
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OEM customize
-
China:
-
Guangdong
-
color:
-
Green,Blue on your request
-
Metrials:
-
FR-4,Aluminum,CEM-1 etc
-
Certificate:
-
CE,ROHS,SGS etc
-
OEM/ODM:
-
Support
-
MOQ:
-
1 PC
-
Copper thickness:
-
0.25OZ~12OZ
-
Silkscreen color:
-
White or on your request.
-
Copper Thickness:
-
1oz
-
Board Thickness:
-
0.2-6.0mm
Our Services
| Our Services | One-stop PCB and PCBA electronic manufacturing services |
| 1.PCB manufacturing service | Need Gerber file(CAM350 RS274X), PCB files(Protel 99,AD,Eagle),etc |
| 2.Components sourcing services | BOM list included detailed Part number and Designator |
| 3.PCB assembly services | The above files and Pick and Place files,assembly drawing |
| 4.Programming & Testing services | Program,instrouction and test method etc. |
| 5.Housing assembly services | 3D files,step or others |
| 6.Reverse engineering services | Samples and others |
| 7.Cable & wire assembly services | Specification & others |
| 8.Others services | Value-added services |
Product Description
PCB Techinecal Capacity
| Layers | Mass production: 2~58 layers / Pilot run: 64 layers |
| Max. Thickness | Mass production: 394mil (10mm) / Pilot run: 17.5mm |
| Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. |
| Min. Width/Spacing | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
| Max. Copper Thickness | UL certificated: 6.0 OZ / Pilot run: 12OZ |
| Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| Max. Panel Size | 1150mm × 560mm |
| Aspect Ratio | 18:1 |
| Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
PCBA technical Capacity
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than 20% | |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
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