- Product Details
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Quick Details
-
EINECS No.:
-
231-072-3
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
JINHUA
-
Model Number:
-
588AB
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Type:
-
Two Components Epoxy Resin Glue
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Color:
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A:Black B=Red black
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Specific gravity:
-
A=1.65 B=0.96
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Viscosity (25℃):
-
A=1500-4000CPS B=500-2000CPS
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Mixing ratio:
-
A: B = 100:20(weight ratio)
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Hardening conditions:
-
25 ℃*8H to 10H or 55℃*2H (2 g)
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Usable time:
-
25℃*(40min (100g)
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Certificate:
-
ROHS,REACH, PAHS, ASTM, EN-71
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Lead Time:
-
3 days
-
Shelf life:
-
6 Months
Quick Details
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CAS No.:
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38891-59-7
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Other Names:
-
epoxy resin potting glue
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MF:
-
C15H16O2C2H7ONC3H5OCl
-
EINECS No.:
-
231-072-3
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
JINHUA
-
Model Number:
-
588AB
-
Type:
-
Two Components Epoxy Resin Glue
-
Color:
-
A:Black B=Red black
-
Specific gravity:
-
A=1.65 B=0.96
-
Viscosity (25℃):
-
A=1500-4000CPS B=500-2000CPS
-
Mixing ratio:
-
A: B = 100:20(weight ratio)
-
Hardening conditions:
-
25 ℃*8H to 10H or 55℃*2H (2 g)
-
Usable time:
-
25℃*(40min (100g)
-
Certificate:
-
ROHS,REACH, PAHS, ASTM, EN-71
-
Lead Time:
-
3 days
-
Shelf life:
-
6 Months
Product Description
Feature
Epoxy resin 588AB is a black epoxy potting resin, can be cured under normal temperature and low temperature, with good flowing property,natural defoaming, it can also be
cured at high temperature.
Application
588AB can be widely used for electronics potting, power encapsulation, mold filling and the insulation of other electronic components,moisture proof,confidential encapsulation, etc.
|
Part
|
588A
|
588B
|
|
|
Color
|
Black
|
Red black
|
|
|
Specific gravity
|
1.65
|
0.96
|
|
|
Viscosity (25℃)
|
1500-4000CPS
|
500-2000CPS
|
|
|
Mixing ratio
|
A: B = 100:20(weight ratio)
|
|
|
|
Hardening conditions
|
25 ℃×8H to 10H or 55℃×2H (2 g)
|
|
|
|
Usable time
|
25℃×40min (100g)
|
|
|
Operation
1.Weigh A and B glue according to the given weight ratio into the prepared cleaned container, fully mixed the mixture again the container wall by clockwise, place it along for 3 to 5 minutes, and then it can be used.
2.Take the glue according to the usable time and dosage of mixture to avoid wasting. When the temperature is below 15 ℃, please heat A glue to 30 ℃ first and then mix it to the B glue (A glue will be thicken in low temperature ); The glue must be sealed lid after use to avoid rejection caused by moisture absorption.
3.When the relative humidity is higher than 85%, the surface of the cured mixture will absorb moisture in the air, and form a
layer of white mist in the surface, so when the relative humidity is higher than 85%, is not suitable for room temperature
curing,suggest to use the heat curing.
2.Take the glue according to the usable time and dosage of mixture to avoid wasting. When the temperature is below 15 ℃, please heat A glue to 30 ℃ first and then mix it to the B glue (A glue will be thicken in low temperature ); The glue must be sealed lid after use to avoid rejection caused by moisture absorption.
3.When the relative humidity is higher than 85%, the surface of the cured mixture will absorb moisture in the air, and form a
layer of white mist in the surface, so when the relative humidity is higher than 85%, is not suitable for room temperature
curing,suggest to use the heat curing.
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