- Product Details
- {{item.text}}
Quick Details
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Brand Name:
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TWS
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Base Material:
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FR4
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Copper Thickness:
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0.5OZ ; 1.0OZ; 1.5OZ;2OZ
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Board Thickness:
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0.6MM;0.8MM;1.0MM;1.6MM
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Min. Hole Size:
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1.6mm
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Min. Line Width:
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0.2mm
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Min. Line Spacing:
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0.2mm
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Surface Finishing:
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OSP/ ENIG
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Inner packing:
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Vacuum packing,Plastic bag
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color:
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white black green red blue yellow
Quick Details
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Model Number:
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TWS-YE050
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Place of Origin:
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Guangdong, China
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Supplier Type:
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custom made
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Brand Name:
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TWS
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Base Material:
-
FR4
-
Copper Thickness:
-
0.5OZ ; 1.0OZ; 1.5OZ;2OZ
-
Board Thickness:
-
0.6MM;0.8MM;1.0MM;1.6MM
-
Min. Hole Size:
-
1.6mm
-
Min. Line Width:
-
0.2mm
-
Min. Line Spacing:
-
0.2mm
-
Surface Finishing:
-
OSP/ ENIG
-
Inner packing:
-
Vacuum packing,Plastic bag
-
color:
-
white black green red blue yellow
Products Description
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Images
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Min Trace Width (a)
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0.075mm (3mil)
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Min Space Width (b)
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0.1mm (4 mil)
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Min Annular Ring
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0.1mm (4 mil)
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SMD Pitch (a)
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0.2 mm(8 mil)
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BGA Pitch (b)
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0.2 mm (8 mil)
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Solder Mask
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Min Solder Mask Dam (a)
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0.0635 mm (2.5mil)
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Solder mask Clearance (b)
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0.1mm (4 mil)
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Min SMT Pad spacing (c)
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0.1mm (4 mil)
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Solder Mask Thickness
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0.0007"(0.018mm)
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Holes
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|
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Min Hole size (CNC)
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0.2 mm (8 mil)
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Min Punch Hole Size
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0.9 mm (35 mil)
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Hole Size Tol (+/-)
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PTH:±0.075mm;NPTH: ±0.05mm
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Hole Position Tol
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±0.075mm
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Plating
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HASL
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2.5um
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Lead free HASL
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2.5um
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Immersion Gold
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Nickel 3-7um Au:1-5u''
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OSP
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0.2-0.5um
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Outline
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Panel Outline Tol (+/-)
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CNC: ±0.125mm, Punching: ±0.15mm
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Beveling
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30°45°
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Gold Finger angle
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15° 30° 45° 60°
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Certificate
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ROHS, ISO9001:2008, SGS, certificate
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