- Product Details
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Quick Details
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Brand Name:
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DeepMaterial
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Model Number:
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DM-6320
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Type:
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Epoxy Underfill Adhesive
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Product series:
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Epoxy Underfill Adhesive
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Colors:
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Black liqui
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Viscosity:
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340
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Curing method:
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Heating
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Composition:
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one-component
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TG/°C:
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134
-
Store:
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-20/6M
Quick Details
-
CAS No.:
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DM-6320
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Other Names:
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Epoxy resin glue
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Place of Origin:
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Guangdong, China
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Brand Name:
-
DeepMaterial
-
Model Number:
-
DM-6320
-
Type:
-
Epoxy Underfill Adhesive
-
Product series:
-
Epoxy Underfill Adhesive
-
Colors:
-
Black liqui
-
Viscosity:
-
340
-
Curing method:
-
Heating
-
Composition:
-
one-component
-
TG/°C:
-
134
-
Store:
-
-20/6M
Product Description
DeepMaterial Epoxy-Based Chip Underfill and COB Encapsulation Materials
DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfillsare high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. DeepMaterial providesformulations for fast filling of very fine pitch parts, fast cure capability, long working and lifespan, as well as the reworkability. Reworkability saves costs by allowing removal of the underfill for reuse of the board.
Flip chip assembly requires stress relief of the welding seam again for extended thermal aging and cycle life. CSP or BGA assembly requires the use of an underfill to improve the mechanical integrity of the assembly during flex, vibration or drop testing.
DeepMaterial's flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability tohave high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler levels, selected for the glass transition temperature and modulus for the intended application.
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy, UV-curing acrylic, or silicone chemistries for good electrical insulation. DeepMaterial COB encapsulating adhesives offer good high temperature stability and thermal shockresistance, electrical insulating properties over a wide temperature range, and low shrinkage, low stress, and chemical resistancewhen cured.
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy, UV-curing acrylic, or silicone chemistries for good electrical insulation. DeepMaterial COB encapsulating adhesives offer good high temperature stability and thermal shockresistance, electrical insulating properties over a wide temperature range, and low shrinkage, low stress, and chemical resistancewhen cured.
Underfill Epoxy Product Selection
Encapsulation Epoxy Product Selection
FAQ
1. What’s the minimum order quantity(MOQ)?
- Minimum 1 unit, small batch and large volumes are acceptable.
2. When can I get the quotation?
- We usually respond within 24 hours on working days receiving your messages.
After we receive the TDS report or sample, we will forward to you with quotation within one week.
3. Which is the safe payment method to trade?
- We accept T/T, LC, Paypal, Trade Assurance and Secure payment on Alibaba platform.
4. How long does it take to deliver?
- For standard adhesive, it will be 7 days for manufacturing.
- For non-standard adhesive, it will be negotiated customized according to your requirements.
5. What’s the shipping method?
- We are able to ship worldwide where Ocean shipping or Air shipping can reach.
- We have a professional packaging team. Products will be packed safely and protectively.
- Minimum 1 unit, small batch and large volumes are acceptable.
2. When can I get the quotation?
- We usually respond within 24 hours on working days receiving your messages.
After we receive the TDS report or sample, we will forward to you with quotation within one week.
3. Which is the safe payment method to trade?
- We accept T/T, LC, Paypal, Trade Assurance and Secure payment on Alibaba platform.
4. How long does it take to deliver?
- For standard adhesive, it will be 7 days for manufacturing.
- For non-standard adhesive, it will be negotiated customized according to your requirements.
5. What’s the shipping method?
- We are able to ship worldwide where Ocean shipping or Air shipping can reach.
- We have a professional packaging team. Products will be packed safely and protectively.
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Packing & Delivery
Company Introduction
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor, electronic applications and surface protection materials for chip packaging and testing.
Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products.
Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance.
Our Advantages
Contact Us
For more info about the adhesives, please kindly contact us as below: Contact Person: Alice Liu Add:7th Floor, Building C, Comlong Science & Technology Park Guanlan High-tech Park, Longhua District, Shenzhen, Guangdong China Tel/Whatsapp/Wechat:+86-13602685929
Email: aliceliu@deepmaterialcn.com Site: https://www.deepmaterialcn.com/
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