High precision dip coater is suitable for dipping and pulling grown films in different liquids of solid silicon wafers.

This product is mainly used for the preparation of thin film materials by liquid phase methods such as sol-gel method. The clean and dry substrate is immersed in the solution (sol), and the immersed substrate is vertically pulled up at a certain speed according to the preset parameters. A layer of film is attached on the substrate, called "wet gel film". With the evaporation of the solvent in the "wet gel film" film layer, the film layer is cured on the substrate to become a"xerogel film". "Dry After further drying and high-temperature heat treatment, the desired nano-film material is obtained. The thickness of the film layer is determined by the pulling speed, liquid concentration and liquid viscosity.The pulled-grown film can be dipped in different liquids. Pulling speed, pulling height, immersion time, coating times (multiple multi-layer coatings), and coating intervals are all continuously adjustable; there is no special requirement for the coating substrate, and the operation is stable, which can greatly improve the accuracy and efficiency of the experiment. It is suitable for the surface coating process of all solid materials such as silicon wafers, wafers, glass, ceramics, and metals.

(Factory supply, can customize specifications according to customer requirements, including accessories and consumables, please contact our staff for details.)

Technical Parameters

1. Reply your inquiry in 24 working hours.

2. Experienced staffs answer all your questions in fluent English.

3. Customized design is available.

4. Exclusive and unique solution can be provided to our customer by our well-trained and professional engineers and staff.

5. Professional factory : We are manufacturer, specializing in laboratory equipment.