- Product Details
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Quick Details
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Model number:
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SP-SAC305-M1330Y
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viscosity:
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200PaS
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graininess:
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20 ~ 38um
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Alloy component:
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Sn96.5-Ag3.0-Cu0.5
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activity:
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strong
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type:
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Welding material
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Cleaning Angle:
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Washed type
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Fusing point:
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217~219℃
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species:
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Lead-free water soluble solder paste
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Scope of application:
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FPC soft board, computer and other high-end electronic products
Quick Details
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Warranty:
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6 MONTHS
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Place of Origin:
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Guangdong, China
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Brand Name:
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S&p Materials
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Model number:
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SP-SAC305-M1330Y
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viscosity:
-
200PaS
-
graininess:
-
20 ~ 38um
-
Alloy component:
-
Sn96.5-Ag3.0-Cu0.5
-
activity:
-
strong
-
type:
-
Welding material
-
Cleaning Angle:
-
Washed type
-
Fusing point:
-
217~219℃
-
species:
-
Lead-free water soluble solder paste
-
Scope of application:
-
FPC soft board, computer and other high-end electronic products
Product Paramenters
Products are targeted, there are questions when purchasing, please consult customer service!
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20 ~ 38/25 ~ 45um
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200g/500g
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Sn96.5-Ag3.0-Cu0.5
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Fusing point
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Introduction of water-soluble solder paste
Lead-free wash solder paste (SAC305) is a lead-free wash solder paste that retains the active ingredients of lead-free wash solder paste, and enhances its activity, and uses innovative environmentally friendly new materials with stable viscosity, good melting effect of micro-solder joint, easy washing of residue after welding, and meets the environmental requirements of ROHS. The solder paste has a wide process window and provides excellent printing performance and excellent welding wettability within 12 hours of use. The solder joint has excellent appearance and is easy to inspect. Hollow performance reaches IPC CLASS II level to ensure product reliability.
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