- Product Details
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Quick Details
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MF:
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C4F6
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EINECS No.:
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211-803-2
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Place of Origin:
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Taiwan, China
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Appearance:
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colorless gas
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Application:
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semiconductor
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Brand Name:
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OEM
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Model Number:
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C4F6
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Product name:
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C4F6 gas
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Hazard Class:
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2.3, 2.1
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Color:
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Colorless
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Certificate:
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ISO9001
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MOQ:
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2 Cylinders
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Hazard Note:
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Toxic
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UN No:
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3162
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Odor:
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Odorless
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Package:
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Seamless Steel Cylinder
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Cylinder Type:
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ISO/GB/DOT
Quick Details
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CAS No.:
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692-50-2
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Purity:
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99.999%
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Other Names:
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HFB
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MF:
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C4F6
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EINECS No.:
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211-803-2
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Place of Origin:
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Taiwan, China
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Appearance:
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colorless gas
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Application:
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semiconductor
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Brand Name:
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OEM
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Model Number:
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C4F6
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Product name:
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C4F6 gas
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Hazard Class:
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2.3, 2.1
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Color:
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Colorless
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Certificate:
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ISO9001
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MOQ:
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2 Cylinders
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Hazard Note:
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Toxic
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UN No:
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3162
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Odor:
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Odorless
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Package:
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Seamless Steel Cylinder
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Cylinder Type:
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ISO/GB/DOT
Hexafluoro-1,3-butadiene (C4F6) is a relatively new etch gas for the manufacturing of semiconductor devices, especially in critical etch processes that need high aspect ratios and selectivity. It is able to combine very high performance with a benign environmental effect. This gas has become available on an industrial scale only recently and we felt the need to increase the data in our possession on its behavior both in the plasma chamber and in the gas delivery systems. We report, in this article, the ion energy distributions, relative ion intensities, and absolute total ion current densities measured both for discharge generated in pure C4F^ and in mixture with Argon. In addition, the ratio of radical densities relative to CF measured using sub-millimeter absorption spectroscopy and optical emission spectroscopy measurements are presented for several gas pressures and gas mixture ratios. A comparison with c-C4F8 is made. We report also the material compatibility of this gas, which show how this 'exotic' gas can be handled with standard materials.The most significant benefits of C4F6 gas become evident from its demonstrated performance for a range of increasingly demanding advanced etch processes that require concomitant high selectivity to 193 nm photoresists, hardmasks, and a variety of underlayers while preserving critical dimension and profile control. Advantages of C4F6 based etch processes, such as high aspect ratio contact/via etch, high selectivity mask open, and dual damascene etch processes, developed on an Applied Materials dielectric etcher, and analyses of PFC emissions data are discussed.
Etching Gases UN 3160 Electronic Grade Octafluorocyclobutane C4F6 Gas
Hexafluoro1,3‐butadiene is a toxic, colorless, odorless, flammable liquefied compressed gas
Hexafluoro1,3‐butadiene is a toxic, colorless, odorless, flammable liquefied compressed gas
Years of research have shown that C4F6 (H-2316) presents several advantages for dry etching of oxide-based materials:
It has a higher etch rate and selectivity than octafluorocyclobutane (c-C4F8 – H318), another extensively used etchant for silicon oxide. Unlike C4F8 (H318), with C4F6 (H2316), only the dielectric substrate is etched. The etched structure has a higher aspect ratio, leading to narrower trenches compared to c-C4F8.VOC emissions are reduced: C4F6 (H2316) has low global warming potential because it has a much shorter lifetime in the atmosphere.
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Product Name :
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HEXAFLUOROCYCLOBUTENE
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Purity:
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99.9~99.99%
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CAS No.:
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697-11-0
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EINECS No.:
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211-803-2
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MF:
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C4F6
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Molar mass:
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697-11-0.mol
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UN No.:
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3162
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Hazard Class :
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2.3+2.1
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Appearance:
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Colorless, non-combustible
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Odor:
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odorless
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Inspection item
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unit
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Requirement
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C4F6
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%
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99.9
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Ar+O2
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ppmv
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≤10
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N2
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ppmv
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≤40
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CO2
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ppmv
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≤20
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CO
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ppmv
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≤7
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THC
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ppmv
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≤700
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HF
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ppmv
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≤10
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Application
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Usage
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Typical Application
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The next generation of core materials required in LSI production processes to minimize circuit line width and depth. The dry etching gas is used in an etching process of micro contact holes. For special gases based on the CxFy chemical formula, the smaller the F/C value, the more CF2 groups are produced. Compared to C2F6 C3F8, C4F6 has a smaller F/C ratio and produces more CF2 groups, which in turn, etches more oxide film. Therefore, C4F6 has a higher selectivity to the oxide film and allows for a more uniform etching.
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Packaging & Delivery
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DOT transportation:
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Liquefied gas, toxic, Nonflammable
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DOT classification:
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2.2
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UN NO.:
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UN 3160
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CAS NO.:
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3162
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CGA/DISS Valve:
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580
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FAQ
FAQ
1. What is the MOQ?
A: From one cylinder
2. What is the delivery time?
A: 7-10 days Exwork after we receive the deposit, After we order the ship or air shipping, we could know total time to do delivery to the customer's country.
3. How do check the gas quality?
A: Firstly, our team will do cylinders treatment(cleaning, drying, vacuuming, pumping, and replacement before filling gas to ensure the cylinder inside is clean and dry)
Secondly, we will test treated cylinders again, to make sure the cylinder inside which is clean and dry.
Thirdly, we will analyze the gas after filling into the cylinders and provide the COA(Certificate of Analysis)
4. Does all cylinders can be recyclable?
A: Usually the working life of seamless steel cylinders is more than 20 years, The disposable cylinders can be used for only one time.
5. Can we send cylinders back to China and refill the gas?
A: Yes, when your company runs out of gas, you could send back the empty cylinders and refill the gas. You just need to inform us before your export, we will handle the cylinders' customs clearance in China.
6. Cylinders and Valve standard Available
A: Cylinder DOT-3AA ISO9809, GB5099, TC-3AAM. EN1964, KGS VALVE: DISS, CGA, DIN, BS, AFNOR, JIS.
7. Can I do LCL with my other common cargo?
A: Our products belong to 2.2 level DG cargo and should shipping with DG cargo, if shipping as common cargo, it is inlegal, we
should order DG cargo from shipping company, if you have other common products, you could put into the cargo and send as DG cargo.
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