- Product Details
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Quick Details
-
Place of Origin:
-
Guangdong, China
-
Model Number:
-
HY510
-
Type:
-
Liquid Glue
-
Thermal conductivity:
-
>1.93W/m-K
-
Gravity:
-
>2.0 g/cm3
-
Operation temperature:
-
-30--300 C
-
Thermal Impedance:
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<0.225°C-in2/W
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Viscosity:
-
1000
-
Operation Temperature(Peak):
-
-30~300°C
-
Moment Bore Temperature:
-
-50~300°C
-
colors:
-
grey
Quick Details
-
CAS No.:
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7085-85-0
-
Other Names:
-
Silicone Sealant
-
EINECS No.:
-
230-391-5
-
Place of Origin:
-
Guangdong, China
-
Model Number:
-
HY510
-
Type:
-
Liquid Glue
-
Thermal conductivity:
-
>1.93W/m-K
-
Gravity:
-
>2.0 g/cm3
-
Operation temperature:
-
-30--300 C
-
Thermal Impedance:
-
<0.225°C-in2/W
-
Viscosity:
-
1000
-
Operation Temperature(Peak):
-
-30~300°C
-
Moment Bore Temperature:
-
-50~300°C
-
colors:
-
grey
Items:HY510
Thermal conductivity:>1.93W/m-K
Thermal Impedance:<0.225°C-in2/W
Gravity:>2.0g/cm3
Viscosity:1000
Thixotropic Index:380±10 1/10mm
Operation Temperature(Peak):-30~300°C
Moment Bore Temperature:-50~300°C
Introduction:
Thermal Grease Paste, Help Your Electrical Appliance To Thermal Conductivity And Heat Dissipation,
To Ensure That The Electronic Instruments, Meters And Other Electrical Performance Stability.
Features:
1.High Grade Stability And Reliability.
2.Apply to CPU, VGA, Chipset, Radiator And Other PC Components.
3.Helps Disperse The Heat From CPU To Heatsink Effectively.
4.Low Thermal Resistance And High Conductivity For Superior Heat Transfer.
5.High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive.6.Compliance with RoHS REACH PFOS requirements
Thermal conductivity:>1.93W/m-K
Thermal Impedance:<0.225°C-in2/W
Gravity:>2.0g/cm3
Viscosity:1000
Thixotropic Index:380±10 1/10mm
Operation Temperature(Peak):-30~300°C
Moment Bore Temperature:-50~300°C
Introduction:
Thermal Grease Paste, Help Your Electrical Appliance To Thermal Conductivity And Heat Dissipation,
To Ensure That The Electronic Instruments, Meters And Other Electrical Performance Stability.
Features:
1.High Grade Stability And Reliability.
2.Apply to CPU, VGA, Chipset, Radiator And Other PC Components.
3.Helps Disperse The Heat From CPU To Heatsink Effectively.
4.Low Thermal Resistance And High Conductivity For Superior Heat Transfer.
5.High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive.6.Compliance with RoHS REACH PFOS requirements
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