Products
High Temperature Waterproof Insulation LED PCB Electronic Components Epoxy Resin Encapsulation Potting AB Glue
High Temperature Waterproof Insulation LED PCB Electronic Components Epoxy Resin Encapsulation Potting AB Glue
High Temperature Waterproof Insulation LED PCB Electronic Components Epoxy Resin Encapsulation Potting AB Glue
High Temperature Waterproof Insulation LED PCB Electronic Components Epoxy Resin Encapsulation Potting AB Glue
High Temperature Waterproof Insulation LED PCB Electronic Components Epoxy Resin Encapsulation Potting AB Glue
High Temperature Waterproof Insulation LED PCB Electronic Components Epoxy Resin Encapsulation Potting AB Glue
High Temperature Waterproof Insulation LED PCB Electronic Components Epoxy Resin Encapsulation Potting AB Glue
High Temperature Waterproof Insulation LED PCB Electronic Components Epoxy Resin Encapsulation Potting AB Glue

High Temperature Waterproof Insulation LED PCB Electronic Components Epoxy Resin Encapsulation Potting AB Glue

FOB Reference Price: Get Latest Price
≥1 Kilograms
US $4.55
Free Inquiry
Customized Request
  • Product Details
  • {{item.text}}

Quick Details

Brand Name:
Hanast
Model Number:
HN-5508
Type:
Double Components Potting Adhesives
Product name:
Epoxy Potting Compound
Application:
Electronic Component
Color:
Black / White
Packing:
A 25 KG (barrel) and group B 5 KG (pot)
Component:
5:1
MOQ:
1kg
Shelf life:
6 months
Delivery time:
7-15days
Material:
Epoxy
Curing Time:
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H

Quick Details

CAS No.:
67763-03-05
Other Names:
Double Components Potting Giue
Place of Origin:
China
Brand Name:
Hanast
Model Number:
HN-5508
Type:
Double Components Potting Adhesives
Product name:
Epoxy Potting Compound
Application:
Electronic Component
Color:
Black / White
Packing:
A 25 KG (barrel) and group B 5 KG (pot)
Component:
5:1
MOQ:
1kg
Shelf life:
6 months
Delivery time:
7-15days
Material:
Epoxy
Curing Time:
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
Before curing
Builder
Epoxy Potting Compound 5508
Curing agent 5508
Pigment
Black / White et al
Bloody / transparent
Surface
A Sticky epoxy resin
Water liquid
Specific gravity, g / cm3
1.4-1.5
1.05
Viscosity of 25℃
4,500—6,000cp s
150—250cp s
Storage Period (25℃)
Six months
Six months
processability
Mixing ratio
A: B=5:1 (weight ratio)
Available for a time of 25℃
2-3H (100g mix)
Curing time
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing
Tensile strength of kg / cm2
16-18
Compressive strength of kg / cm2
18-22
Resistance to the voltage of kv / mm
20-22
Sheet resistance Ω-cm
1.2*1014
Volume resistivity Ω-cm
1.1*1015
Contraction percentage%
0.35-0.55
Water absorption rate was 25℃ * 24H
<0.03%
Hardness of SHORE D
85-95
Distortion temperature ℃
130-150
Low temperature resistant ℃
-30
Product Description
APP
Post My RFQ
WhatsApp
+86-17326049340