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pcb raw material fr4 for printed circuit board
pcb raw material fr4 for printed circuit board
pcb raw material fr4 for printed circuit board
pcb raw material fr4 for printed circuit board
pcb raw material fr4 for printed circuit board
pcb raw material fr4 for printed circuit board
pcb raw material fr4 for printed circuit board
pcb raw material fr4 for printed circuit board

pcb raw material fr4 for printed circuit board

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≥100 Sheets
US $16
≥500 Sheets
US $10
≥1000 Sheets
US $3
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Quick Details

Rated Voltage:
≥40KV
Tensile Strength:
≥340Mpa
Colour:
Natural,green , black , yellow ,brown
Tickness:
0.1mm~200mm
Flammability:
UL94V-0
TG:
135℃
Spot good size:
36*48inch,40*48inch , 48*96inch
Size:
1000*2000mm , 1020*1220mm , 1220*2440mm
Samples:
Available
Surface finishing:
Smooth
Port:
Shang hai
name:
copper clad laminate

Quick Details

Place of Origin:
Jiangsu, China
Brand Name:
CF
Model Number:
fr-4, cem-1 ccl
Rated Voltage:
≥40KV
Tensile Strength:
≥340Mpa
Colour:
Natural,green , black , yellow ,brown
Tickness:
0.1mm~200mm
Flammability:
UL94V-0
TG:
135℃
Spot good size:
36*48inch,40*48inch , 48*96inch
Size:
1000*2000mm , 1020*1220mm , 1220*2440mm
Samples:
Available
Surface finishing:
Smooth
Port:
Shang hai
name:
copper clad laminate

Product description

FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with copper foil on one side or both sides, and CCL is finally formed by hot pressing and curing.
FR-4 copper clad laminated sheet has excellent thermal stability and machinability, widely used in the manufacture of printed circuit board (PCB) for television sets, computers, communications equipment and other electronic products.
Item Name
FR-4 Copper clad laminate
Copper Thickness
18um,25um,35um,70um
Size
40*48inch,41*49inch,43*49inch
Color
yellow/white/green/grey
Thickness
0.4mm,0.8mm,1mm,1.2mm,
1.6mm,2.4mm
Glass Transition
Temperature
135-155 °C
Relevant product parameters
Test Item
Test Condition
Unit
SPEC
Typical Value
Tg
DSC
°C
≥125
135
Peel strength(1OZ)
288°C,10S
N/mm
≥1.05
1.41
Thermal Stress
288°C,10S/solder dip
____
>10
60S/ No delamination
No Delamination
Flexural Strength
N/mm2
LW
≥415
500
CW
≥345
450
Flammability
E24/125
____
UL94 V-0
V-0
Surface Resistivity
After moisture
≥1. 0×104
2.0×106
Volume Resistivity
After moisture
MΩ.cm
≥1.0×106
2.0×108
Dielectric Constant(1MHZ)
1MHz C-24/23/50
____
≤5.4
4.7
Dissipation Factor(1MHZ)
1MHz C-24/23/50
____
≤0.035
0.017
Loss Tangent
1MHz C-24/23/50
____
≤0.035
0.016
Arc Resistivity
D-48/50+D-0.5/23
S
≥60
135
Dielectric Breakdown
D-48/50+D-0.5/23
KV
≥40
60
Moisture Absorption
D-24/23
%
≤0.8
0.15
CTI
IEC60112 Method
V
175~250
210
Cooper clad laminate

AL CCL
FR-4
FR-1
CEM-1
XPC
Base material
aluminum
fiberglass
fiberglass
paper+fiber glass
paper
Color
blue film
green film
light green,yellow
brown
yellow+white
brown
Copper foil
single or double side:18,25,35,70 micron
single side:18,25,35,70  micron
Sheet thickness
0.4-2mm

Size
1000*1200mm
500*600mm
1000*600mm
500*1200mm
40''*48'' , 41''*49'' , 43''*49''

41''*49''
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Product advantage
Product display
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