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Precision Blade Dicing Cutting Saw for Wafer Cutting
Precision Blade Dicing Cutting Saw for Wafer Cutting
Precision Blade Dicing Cutting Saw for Wafer Cutting
Precision Blade Dicing Cutting Saw for Wafer Cutting
Precision Blade Dicing Cutting Saw for Wafer Cutting
Precision Blade Dicing Cutting Saw for Wafer Cutting
Precision Blade Dicing Cutting Saw for Wafer Cutting
Precision Blade Dicing Cutting Saw for Wafer Cutting

Precision Blade Dicing Cutting Saw for Wafer Cutting

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≥1 Sets
US $64000
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Quick Details

Marketing Type:
Hot Product 2023

Quick Details

Place of Origin:
Guangdong, China
Brand Name:
minderhightech
Weight (KG):
600
Marketing Type:
Hot Product 2023
Products Description

DS820--precision dicing machine

DS820 The precision dicing machine is equipped with a 15-inch LCD touch screen, with a friendly GUI interface, and easy and convenient to align the workpiece; using the DS-300 software control system, the frame is reasonable, the operation is convenient, and the production efficiency is improved; the equipment has stable performance, high reliability, and maintenance cost Low.
Specification
Configuration and performance
Processing size
φ200mm or φ180mm
Groove depth
≦4mm or customized
Flatness of worktable
±0.005mm/100mm
Alignment system
70*Straight light﹢Ring light (210*optional)
Spindle
range of rotation
10000~50000rpm
Output Power
1.5KW
X axis
Drive way
servo motor
Workbench left and right stroke
380mm
Stroke resolution
0.001mm
Speed setting range
0.1~400mm/s
Y axis
Drive way
Stepping motor ﹢ grating closed loop control system
Spindle back and forth stroke
210mm
Stroke resolution
0.0005mm
Single-step positioning accuracy
≦0.003mm/5mm
Full positioning accuracy
≦0.005mm/210mm
Z axis
Drive way
Stepper motor
Spindle up and down stroke
30mm
Stroke resolution
0.001mm
Repeatability
0.001mm
θ axis
Drive way
DD motor
Angle range
380º
Angle resolution
0.0005º
Basic specifications
power supply
Single phase, AC220±10%, 3.0kVA
power consumption
0.6KW during processing (reference value)
When warming up 0.4KW (reference value)
Compressed air
Pressure 0.5~0.6Mpa, maximum consumption 180L/min
Cutting water
Pressure 0.2~0.3Mpa, maximum consumption 3.0L/min
Cooling water
Pressure 0.2~0.3Mpa, maximum consumption 1.5L/min
Exhaust volume
2.0m³/min(ANR)
Dimensions W×D×H
775mm*960mm*1650mm
weight
600kg

DS830--precision dicing machine

DS830 The precision dicing machine is equipped with an imported 1.5kw high-speed spindle; driven by the θ-axis DD motor, the accuracy of the rotation angle, the resolution of the rotation angle, and the flatness of the table are improved; the power distribution system is upgraded, and multiple functions can be selected according to customer needs.
Specification
Configuration and performance
Processing size
φ200mm or φ180mm
Groove depth
≦4mm or customized
Flatness of worktable
±0.005mm/150mm
Alignment system
70x straight light﹢ring light (210+optional)
Spindle
range of rotation
10000~50000rpm
Output Power
1.5KW (2.4KW optional)
X axis
Drive way
servo motor
Workbench left and right stroke
380mm
Stroke resolution
0.001mm
Speed setting range
0.1~500mm/s
Y axis
Drive way
Stepping motor ﹢ grating closed loop control system
Spindle back and forth stroke
210mm
Stroke resolution
0.0005mm
Single-step positioning accuracy
≦0.003mm/5mm
Full positioning accuracy
≦0.005mm/210mm
Z axis
Drive way
Stepper motor
Spindle up and down stroke
30mm
Stroke resolution
0.001mm
Repeatability
0.001mm
θ axis
Drive way
DD motor
Angle range
380º
Angle resolution
0.0002º
Basic specifications
power supply
Single phase, AC220±10%, 3.0kVA
power consumption
0.6KW during processing (reference value)
When warming up 0.4KW (reference value)
Compressed air
Pressure 0.5~0.6Mpa, maximum consumption 220L/min
Cutting water
Pressure 0.2~0.3Mpa, maximum consumption 3.5L/min
Cooling water
Pressure 0.2~0.3Mpa, maximum consumption 1.5L/min
Exhaust volume
2.0m³/min(ANR)
Dimensions W×D×H
775mm×960mm×1650mm
weight
600kg
Detail

Features:

√ Blade database management
√ Workpiece cutting database management
√ Auto focus function
√ Two-way lifting knife cutting function
√ Compensation function for blade exposure
√ Multiple safety guarantees and alarm functions

Conditions of Use:

1. Please set the machine in an environment of 20~25ºC (the fluctuation range is controlled within ±1ºC); the indoor humidity should be 40%~60%, keep constant without condensation.
2. Please use clean compressed air with atmospheric pressure dew point below -15ºC, residual oil content of 0.1ppm and filtration degree above 0.01um/99.5.
3. Please control the water temperature of the cutting water to room temperature 2ºC (fluctuation range within ±1ºC), and control the cooling water temperature to be the same as room temperature (fluctuation range control within ±1ºC).
4. Please avoid the device from gravitational impact and any external vibration threats. In addition, please do not install the equipment near blowers, vents, devices that generate high temperatures, and devices that generate oil.
5. Please install this equipment on a waterproof floor and a place with drainage treatment.
6. Please operate strictly in accordance with the company's product instruction manual.

Application areas:

diodes, triodes, LED packaging, NTC, MEMS, IC, photovoltaics, medical devices, scintillation crystals

Precision cutting materials

silicon wafer, PCB board, EMC, ceramics, glass, quartz, gallium arsenide, lithium niobate, sapphire, crystal

Auto focus function:

Through the visual algorithm, coordinated with the motion control, the lens can be automatically raised and lowered, and the clear position of the workpiece image can be quickly obtained.
Accessories Consumables
Application field

Brand customers

Well-known company
Colleges and universities
Factory
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