- Product Details
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Quick Details
-
Board Size:
-
oem
-
Model Number:
-
multi-layers
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
Senyan`
-
Copper Thickness:
-
0.5-6 oz
-
Min. Hole Size:
-
0.2 mm
-
Min. Line Width:
-
01. mm
-
Min. Line Spacing:
-
0.1 mm
-
Surface Finishing:
-
HASL, HASL-LF, ENIG, OSP,, HASL
-
PCB Assembly process:
-
DIP. SMT PCB Assembly
-
Silkscreen color:
-
Black.white.customized
-
Solder Mask:
-
Green. Red. Blue. White. Black.Yellow
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PCB Test:
-
Flying-Probe PCB Test
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Application:
-
Electronics Device
-
Material:
-
FR4 94v0 Circuit Board
-
Service:
-
One-stop Service
-
MOQ:
-
1 PCS
Quick Details
-
Number of Layers:
-
4-Layer, 6-Layer, 8-Layer
-
Base Material:
-
FR-4, CEM-1, Aluminium, 94v0, FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
-
Board Thickness:
-
0.2-7mm
-
Board Size:
-
oem
-
Model Number:
-
multi-layers
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
Senyan`
-
Copper Thickness:
-
0.5-6 oz
-
Min. Hole Size:
-
0.2 mm
-
Min. Line Width:
-
01. mm
-
Min. Line Spacing:
-
0.1 mm
-
Surface Finishing:
-
HASL, HASL-LF, ENIG, OSP,, HASL
-
PCB Assembly process:
-
DIP. SMT PCB Assembly
-
Silkscreen color:
-
Black.white.customized
-
Solder Mask:
-
Green. Red. Blue. White. Black.Yellow
-
PCB Test:
-
Flying-Probe PCB Test
-
Application:
-
Electronics Device
-
Material:
-
FR4 94v0 Circuit Board
-
Service:
-
One-stop Service
-
MOQ:
-
1 PCS
Specification
|
Layer
|
1-20 layer
|
|
Material Type
|
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
|
|
Board Thickness
|
0.21mm to 7.0mm
|
|
Copper Thickness
|
0.5 OZ to 6 oz
|
|
Size（Custom）
|
Max. Board Size: 580mm×1100mm
|
|
|
Min. Drilled Hole Size: 0.2 mm (8 mil)
|
|
|
Min. Line Width: 4mil (0.1mm)
|
|
|
Min. Line Spacing: 4mil (0.1mm)
|
|
Surface Finishing
|
HASL / HASL lead free, HAL, Chemical tin,
|
|
|
Immersion Silver / Gold, OSP, Gold plating
|
|
Solder Mask Color
|
Green / Yellow / Black / White / Red / Blue
|
|
Tolerance
|
Shape tolerance: ±0.13
|
|
|
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
|
|
Certificate
|
International Certification Standards
|
|
Special Requirements
|
Buried and blind vias+controlled impedance +BGA
|
|
Profiling
|
Punching, Routing, V-CUT, Beveling
|
Product Description
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