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Conductive Liquid Silicone Glue Silicone Rubber Sealant/Electronic Potting Compound
Conductive Liquid Silicone Glue Silicone Rubber Sealant/Electronic Potting Compound
Conductive Liquid Silicone Glue Silicone Rubber Sealant/Electronic Potting Compound
Conductive Liquid Silicone Glue Silicone Rubber Sealant/Electronic Potting Compound
Conductive Liquid Silicone Glue Silicone Rubber Sealant/Electronic Potting Compound
Conductive Liquid Silicone Glue Silicone Rubber Sealant/Electronic Potting Compound
Conductive Liquid Silicone Glue Silicone Rubber Sealant/Electronic Potting Compound
Conductive Liquid Silicone Glue Silicone Rubber Sealant/Electronic Potting Compound

Conductive Liquid Silicone Glue Silicone Rubber Sealant/Electronic Potting Compound

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≥2 Pieces
US $6.45
≥100 Pieces
US $5.59
≥1000 Pieces
US $4.75
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Quick Details

Brand Name:
TBL(electronic potting compound)
Model Number:
TBL-6619
Type:
Thermal potting silicone sealant
Product name:
Electronic potting compound
Color:
White/Black/Gray
Appearance:
Liquid Two Component
Features:
Fast solidify; Fast surface dry
MOQ:
100KG
Viscosity:
Favorable
Material:
100% Silicone
Feature:
Bonding Strength
Keywords:
Siliconesealant

Quick Details

CAS No.:
68083-19-2
Other Names:
Silicone Sealant
Place of Origin:
Guangdong, China
Brand Name:
TBL(electronic potting compound)
Model Number:
TBL-6619
Type:
Thermal potting silicone sealant
Product name:
Electronic potting compound
Color:
White/Black/Gray
Appearance:
Liquid Two Component
Features:
Fast solidify; Fast surface dry
MOQ:
100KG
Viscosity:
Favorable
Material:
100% Silicone
Feature:
Bonding Strength
Keywords:
Siliconesealant
Specification
Reference Standards
Property
Unit
Value
Properties before curing 1 at 25±2℃
GB/T 14074
Appearance (A)
/
Black
Appearance (B)
/
White
GB/T 279
Viscosity (A)
mPa.s
5000-6000
Viscosity (B)
mPa.s
5000-6000
GB/T 13354
Density (A)
g/cm3
1.65±0.1
Density (B)
g/cm3
1.65±0.1
Serviceability2 at 25±2℃
GB/T 13477.5
Tack-free time at 25℃
min
15-45
Enterprise Standard
Working Time at 25℃
h
1-3
Enterprise Standard
Working Time at 25℃
min
15-30
Properties cured 7 days3 at 25±2℃
GB/T 531.1
Hardness
Shore A
50±5
ASTM D5470
Thermal Conductivity
W/m.k
≥0.6
GB/T 1695
Dielectric Strength
kV/mm
≥20
GB/T 1693
Dielectric Constant
/
≥2.8
GB/T 1692
Volume Resistivity
Ω·cm
≥1×1014
Note:1 and 2 Inspection per batch.    3 regular random inspection.
Product Description

TBL-6619 Thermal Potting Silicone Sealant

Thermal conductivity, Flame Retardant Black Addition Type Potting Silicone Sealant

Product Features Good fluidity, Easy potting Can be cured at room temperature or under heating UL94-V0 tested 100% Solid, no curing by-products Working Temperature -50℃~200℃ Complies with ROHS Typical Application High Power Module Controller Inverter Automotive Electronics Product LED Drive Power Note The sealant will be delaminated during storage, and it will be stirred evenly before mixing, which will not affect the properties of the product.
Product packaging
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