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PCBA Assembly Factory Pure Sine Wave Inverter Circuit DC 12V To AC 220V 300W Inverter Board
PCBA Assembly Factory Pure Sine Wave Inverter Circuit DC 12V To AC 220V 300W Inverter Board
PCBA Assembly Factory Pure Sine Wave Inverter Circuit DC 12V To AC 220V 300W Inverter Board
PCBA Assembly Factory Pure Sine Wave Inverter Circuit DC 12V To AC 220V 300W Inverter Board
PCBA Assembly Factory Pure Sine Wave Inverter Circuit DC 12V To AC 220V 300W Inverter Board
PCBA Assembly Factory Pure Sine Wave Inverter Circuit DC 12V To AC 220V 300W Inverter Board
PCBA Assembly Factory Pure Sine Wave Inverter Circuit DC 12V To AC 220V 300W Inverter Board
PCBA Assembly Factory Pure Sine Wave Inverter Circuit DC 12V To AC 220V 300W Inverter Board

PCBA Assembly Factory Pure Sine Wave Inverter Circuit DC 12V To AC 220V 300W Inverter Board

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Quick Details

Base Material:
FR-4/aluminum/cem-1/cem-3/FR-1
Board Thickness:
1.6mm
Min. Hole Size:
0.10mm
Min. Line Width:
0.10mm
Min. Line Spacing:
0.1mm4mil
Surface Finishing:
HASL
Application:
consumer electronics
Certificate:
ROSH, ISO9001
Keywords:
home appliance
Coil Type:
Single Coil

Quick Details

Model Number:
YCT23-TM157
Place of Origin:
Guangdong, China
Brand Name:
YCT
Base Material:
FR-4/aluminum/cem-1/cem-3/FR-1
Board Thickness:
1.6mm
Min. Hole Size:
0.10mm
Min. Line Width:
0.10mm
Min. Line Spacing:
0.1mm4mil
Surface Finishing:
HASL
Application:
consumer electronics
Certificate:
ROSH, ISO9001
Keywords:
home appliance
Coil Type:
Single Coil
Product Description
PCBA Assembly Factory Pure Sine Wave Inverter Circuit DC 12V To AC 220V 300W Inverter Board

Features:
* DC-AC Power Inverter
* 12V or 24V DC input
* Power ON-OFF switch
* Input voltage range: -15% ~ +25%
* Output voltage regulation: ±10%
* Protections: Bat. Low alarm / Bat. Low shutdown / Over voltage / Over temp./ Output short / Input polarity reverse / Over load.
* Output waveform: Modified sine wave
* Cooling fan ON-OFF control
* Topology: Microprocessor
* Approvals: e13/ CE


APPLICATIONS:
Home appliance, Power tools, Office and Portable equipment and Vehicle ...etc.

DC to AC Power Inverter PCBA








OUTPUT
SAFETY MODEL NO.
TM300W
AC VOLTAGE
110V
230V
RATED POWER
300W
SURGE POWER
600W
WAVEFORM
Modified Sine Wave
FREQUENCY
60Hz ±1%
50Hz ±1%
AC REGULATION
±10%
STANDARD RECEPTACLES
TYPE-2* 2ea
TYPE-3* 2ea
LED INDICATOR
Green LED for power on; Red LED for power failure status





INPUT
DC CURRENT
35A
15A
NO LOAD CURRENT DRAW
0.36A
0.2A
DC VOLTAGE
12V
24V
VOLTAGE RANGE
10 ~ 15VDC
21 ~ 30VDC
EFFICIENCY (Typ.)
82%
85%
DC CONNECTOR
Battery clip*1ea
FUSE
Battery cord 35 A * 1, Cigarette plug 15 A* 1
Battery cord 20 A * 1, Cigarette plug 10 A* 1





PROTECTION
BAT. LOW ALARM
10±0.5V
20± 0.8V
BAT. LOW SHUTDOWN
9.5 ±0.5V
19.5± 0.8V
OVER LOAD
>1200W shut down o/p voltage, re-power to recover
OVER VOLTAGE
15 ~ 17V
30 ~ 32V
OVER TEMPERATURE
45 ± 5°C 113±9°F
OUTPUT SHORT
Shut-off
WORKING TEMP.BAT. POLARITY
By fuse open



ENVIRONMENT
WORKING TEMP.
0 ~ +30°C @ 100% load ; +40°C @ 50% load
WORKING HUMIDITY
20% ~ 90% RH non-condensing
STORAGE TEMP. HUMIDITY
30 ~ +70°C / -22 ~ +158 °F 10 ~ 95% RH
TEMP. COEFFICIENT
±0.05%/ °C/ (0 ~ 50°C )



SAFETY & EMC
ISOLATION RESISTANCE
I/P-O/P:100M Ohms / 500VDC / 25°C / 70%RH
EMI CONDUCTION & RADIATION
Compliance to EN55022 class B, 72/ 245/ CEE, 95/ 54/ CE
EMC IMMUNITY
Compliance to EN61000-4-2,3
LVD
Compliance to EN60950
MTBF
200Khrs min. MIL-HDBK-217F (25°C)
Medical PCBA Production Capacity


Types of PCB assembly
SMT (Surface Mounted Technology)
THT (Through Hole Technology)
Mixed (surface mount and through hole) technology
Cable assembly



Components
Passive Component: small as 01005, 0201
BGA, uBGA, QFN, POP, SOP,SSOP,PLCC,LGA
Fine Pitch Parts: 0.25mm fine pitch parts
Max Component Height: 25mm(SMT), Top 120mm/Bot 15mm (Wave-Solder)
Component Package
Reels, cut tape, Tube and tray, Loose parts and bulk

Board Dimension
Min Board Size: No Limited
Max Board Size: 680 x 500mm
Board Shape
We can assemble boards in Rectangular, Circular and irregular
Board Type
Rigid PCB, Flexible PCB, Rigid-flex PCB
Assembly process
Lead-Free (RoHS)


Design file format
Gerber RS-274X
BOM (Bill of Materials) (.xls, .csv, . xlsx)
Centroid(Pick-N-Place/XY file)


Electrical testing
X-ray Inspection
AOI (Automated Optical Inspection)
Functional testing
Certificate
ISO13485, IATF16949, ISO9001,ISO14001
Quality Standards
IPC-A-600/IPC-A-610 compliance
Type of Service
Turn-key, partial turn-key or consignment
Our products used in various fields such as consumer electronics, industrial control, telecommunication, computer and medical. Wedo not only offer the simple Fr4 PCB but also Alu PCB, Ceramic ALN and AL2O3, metal and copper base PCB, Rigid-flex board, heavycopper and etc.
Specification
PCB Techinecal Capacity
Layers
Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness
Mass production: 394mil (10mm) / Pilot run: 17.5mm
Materials
FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO,
PPE, Hybrid, Partial hybrid, etc
Min. Width/Spacing
Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness
6.0 OZ / Pilot run: 12OZ
Min. Hole Size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Surface Finish
HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and
Resistance control
PCBA technical Capacity




Advantages
----Professional Surface-mounting and Through-hole soldering technology
----Various sizes like 1206,0805,0603 components SMT technology
----ICT(In Circuit Test),FCT(Functional Circuit Test)
----PCB Assembly With UL,CE,FCC,Rohs Approval
----Nitrogen gas reflow soldering technology for SMT.
----High Standard SMT&Solder Assembly Line
----High density interconnected board placement technology capacity.


Components
Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP
Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball
Testing
Flying Probe Test,X-ray Inspection AOI Test




SMT
Position accuracy: 20 um
Components size: 0.4×0.2mm(01005) —130×79mm, Flip-CHIP, QFP, BGA, POP
Max. component height: 25mm
Max. PCB size: 680×500mm
Min. PCB size: no limited
PCB thickness: 0.3 to 6mm


Wave-Solder
Max. PCB width: 450mm
Min. PCB width: no limited
Component height: Top 120mm/Bot 15mm


Sweat-Solder
Metal type: part, whole, inlay, sidestep
Metal material: Copper, Aluminum
Surface Finish: plating Au, plating sliver, plating Sn
Air bladder rate: less than 20%

Press-fit
Press range: 0-50KN
Max. PCB size: 800X600mm
Packing & Delivery
Vacuum Packing with Carton Box
APP
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+86-17326049340