- Product Details
- {{item.text}}
Quick Details
-
Board Size:
-
200*300mm, or can be Customized
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Model Number:
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JH-MPCB-057
-
Place of Origin:
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Guangdong, China
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Brand Name:
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JinHua
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Copper Thickness:
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1OZ
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Min. Hole Size:
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0.15mm
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Min. Line Width:
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3mil
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Min. Line Spacing:
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3mil
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Surface Finishing:
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ENIG
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Product name:
-
quick turn pcb
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Keywords:
-
custom 4 Layer pcb
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Special requirements:
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Blind Vias+Controlled Impedance+BGA
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MOQ:
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1 pcs
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Testing Service:
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100% AOI Testing
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Certificate:
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ISO9001/Iso14001/CE/ROHS/IATF16949
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Service:
-
OEM multi layer pcb Services Provided
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Customize:
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Consumer Electronics
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Application:
-
Security Equipment
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PCB Assembly process:
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DIP SMT PCB Assembly
Quick Details
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Number of Layers:
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4-layer
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Base Material:
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FR4, CEM, High TG
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Board Thickness:
-
1.6mm
-
Board Size:
-
200*300mm, or can be Customized
-
Model Number:
-
JH-MPCB-057
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
JinHua
-
Copper Thickness:
-
1OZ
-
Min. Hole Size:
-
0.15mm
-
Min. Line Width:
-
3mil
-
Min. Line Spacing:
-
3mil
-
Surface Finishing:
-
ENIG
-
Product name:
-
quick turn pcb
-
Keywords:
-
custom 4 Layer pcb
-
Special requirements:
-
Blind Vias+Controlled Impedance+BGA
-
MOQ:
-
1 pcs
-
Testing Service:
-
100% AOI Testing
-
Certificate:
-
ISO9001/Iso14001/CE/ROHS/IATF16949
-
Service:
-
OEM multi layer pcb Services Provided
-
Customize:
-
Consumer Electronics
-
Application:
-
Security Equipment
-
PCB Assembly process:
-
DIP SMT PCB Assembly
Multilayer PCB is a Printed Circuit Board with more than 2 layers. A Double-Sided PCB has two conductive layers on top and bottom of the PCB substrate. A Multilayer PCB must have a minimum of 3 conductive layers of conductive material or copper layer. All the layers are interconnected with copper plated holes. The layers can be 4, 6, 8…upto 32 layers.
Product Description
JINHUA PCB Standard Capability | |||
Item | Process | Manufacturing Capability | Remark |
1 | Surface Finishing |
HASL, HASL LF, ENIG, gold fingers plating, OSP, Immersion Ag,
Immersion Sn, Carbon Ink, peelable mask, plug vias with resin |
|
2 | Board Thickness | 0.1 MM ~ 8.0 MM | |
3 | Layers | 1 ~ 32 L | |
4 | Material | Brand: KB, ITEQ, Shengyi, Huazheng,NanYa, CEM, Arlon,Rogers, Teflon, Polymide, panasonic, Aluminum Base, Halogen Free,Peters Soldermask,Kapton high temperature tape, Taiyo Ink | |
TG: low to high, TG135 to TG180; CTI: 175 to 600 | |||
5 | Board Size | Max board size:650 x 1200 MM; Min board size: 3*3 MM | |
6 | Inner Layer | (1) ring of line: single sided 4mil | Aspect ratio:10: 1 |
(2) min trace w/s for 1 OZ:3 mil/2.6mil | Max finished copper thickness:18/18 oz | ||
(3) hole to line or pad spacing: min 6mil | |||
7 | Drilling | (1) min finished hole size: laser 0.1mm mechanical 0.15mm | |
(2) PTH hole size tolerance: ± 3 mil,NPTH hole size tolerance: ± 2 mil | hole position registration tolerance: ± 2 mil | ||
(3) min slot size:0.55 mm | |||
8 | Outer Layer | (1) 1oz: 3/3 mil, 2oz:5/5 mil | Max finished copper thickness:18/18 oz |
9 | Plating | (1) hole wall copper thickness 1-10 mil | |
(2) 10:1 | |||
10 | Soldermask | (1) min soldermaks bridge 4mil | min PAD 20 mil |
11 | Silkscreen | Color:white, black, yellow, red...etc. | Serial number, Barcode, QR code |
12 | Profiling | (1) Tolerance of outline: ± 0.1mm | |
(2) V-CUT Angle: 30 degree & 45 degree | min V-Cut width 75 MM | ||
(3) Depth:Board thickness≥1.2 mm Remain thicknss: 1/3;
Board thickness≤1.2 mm, remain thickness 20 mil (0.5 mm) |
min distance V-Cut to copper 0.4 MM | ||
(4) Bevelling angle/depth: 20°/1.8 mm;30° /1.0 mm;45°/0.5 mm;tolerance:± 5°/± 0.2 mm | |||
13 | Bow and Twist | 1L≤1.0% 2L≤0.75% Multi layers≤0.75% | |
14 | Monthly Capcity | 120,000 M2 |
Layer | Quick Turn/Usual Time | Mass Production |
2L | 24 hours/4-5 days | 8-10 days |
4L | 48 hours/6-7 days | 10-12 days |
6L | 72 hours/7-8 days | 12-14 days |
8L | 72 hours/8-10 days | 16-18 days |
10L | 96 hours/12-14 days | 18-20 days |
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