- Product Details
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Quick Details
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Supplier Type:
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OEM ODM
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Copper Thickness:
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1oz 2oz 3oz 4oz 5oz or Custom
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Product name:
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OEM PCB PCBA Board Assembly
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Application:
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Home Appliances, Electronics Device,Consumer Electronics
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Service:
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One-stop Turnkey PCB PCBA Service
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Surface Finishing:
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HASL\OSP\immersion Gold
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Certificate:
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UL/ISO9001/RoHS/ISO14001/ISO13485/TS16949
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Base Material:
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FR4/ROGERS/Aluminum/High TG
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PCBA service:
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SMD SMT DIP Component Assembly
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Layer:
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1-64 Layers
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Board Thickness:
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0.2mm-7.0mm
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Testing Service:
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AOI X-Ray Function Test
Quick Details
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Model Number:
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PCBA 0001
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Place of Origin:
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Bac Ninh, Vietnam
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Brand Name:
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IBE smart electronic pcba
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Supplier Type:
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OEM ODM
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Copper Thickness:
-
1oz 2oz 3oz 4oz 5oz or Custom
-
Product name:
-
OEM PCB PCBA Board Assembly
-
Application:
-
Home Appliances, Electronics Device,Consumer Electronics
-
Service:
-
One-stop Turnkey PCB PCBA Service
-
Surface Finishing:
-
HASL\OSP\immersion Gold
-
Certificate:
-
UL/ISO9001/RoHS/ISO14001/ISO13485/TS16949
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Base Material:
-
FR4/ROGERS/Aluminum/High TG
-
PCBA service:
-
SMD SMT DIP Component Assembly
-
Layer:
-
1-64 Layers
-
Board Thickness:
-
0.2mm-7.0mm
-
Testing Service:
-
AOI X-Ray Function Test
Product Description
Custom wireless home theater subwoofer speaker mp3 amplifier pcb board audio amplifier circuit board
PCB Techinecal Capacity
Layers
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Mass production: 2~58 layers / Pilot run: 64 layers
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Max. Thickness
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Mass production: 394mil (10mm) / Pilot run: 17.5mm
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Material
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FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO,
PPE, Hybrid, Partial hybrid, etc |
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Min. Width/Spacing
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Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
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Max. Copper Thickness
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UL certificated: 6.0 OZ / Pilot run: 12OZ
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Min. Hole Size
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Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
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Surface Finish
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HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
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Special Process
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Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control
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PCBA technical Capacity
Advantages
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----Professional Surface-mounting and Through-hole soldering technology
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----Various sizes like 1206,0805,0603 components SMT technology
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----ICT(In Circuit Test),FCT(Functional Circuit Test)
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----PCB Assembly With UL,CE,FCC,Rohs Approval
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----Nitrogen gas reflow soldering technology for SMT.
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----High Standard SMT&Solder Assembly Line
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----High density interconnected board placement technology capacity.
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Components
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Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP
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Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball
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Testing
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Flying Probe Test,X-ray Inspection AOI Test
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