- Product Details
- {{item.text}}
Quick Details
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Solder mask color:
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Green Blue Black
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Way of shipping:
-
DHL/UPS/EMS/Feldex
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Package:
-
vacuum package
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Service:
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EMS/OEM
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Certification::
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ISO9001
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Layer Count:
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1-24 Layer
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Test:
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Flying probe test /test fixture
Quick Details
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Model Number:
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customized
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Place of Origin:
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Guangdong, China
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Brand Name:
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Jinghon
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Solder mask color:
-
Green Blue Black
-
Way of shipping:
-
DHL/UPS/EMS/Feldex
-
Package:
-
vacuum package
-
Service:
-
EMS/OEM
-
Certification::
-
ISO9001
-
Layer Count:
-
1-24 Layer
-
Test:
-
Flying probe test /test fixture
PCB Item
|
Manufacture Capacity
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Layer Counts
|
1--40L
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Base Material:
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FR4,High-TG FR4,Halogen free,aluminum,High Frequency(Taconic,Aron,PTFE,F4B)
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Max board size(mm)
|
1200x400mm
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Board Thickness
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0.4mm--7mm
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Minimum line/space
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0.075mm
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Min Hole Size(mechanical)
|
0.15mm
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Min Hole Size(laser hole)
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0.1mm
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Copper Weight
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0.5--6oz
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Surface Finish
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HAL,lead-free HAL,ENIG,Plated Gold,Immersion Gold,OSP
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Solder Mask
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Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
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Silkscreen
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White, Black, Blue,Yellow
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Acceptable File Format
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Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000
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Outline profile
|
Rout/ V-cut/ Bridge/ Stamp hole
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PCBA Item
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TECHNICAL PARAMETER
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Stencil size/range:
|
736x736mm
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Minimum IC pitch:
|
0.30mm
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Maximum PCB size:
|
1200x 500mm
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Minimum PCB thickness:
|
0.35mm
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Minimum chip size:
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0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
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Maximum BGA size:
|
74x74mm
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BGA ball pitch:
|
1.00mm (minimum), 3.00mm (maximum)
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BGA ball diameter:
|
0.40mm (minimum), 1.00mm (maximum)
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QFP lead pitch:
|
0.38mm (minimum), 2.54mm (maximum)
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Frequency of stencil cleaning:
|
1 time/5 to 10 pieces
|
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