- Product Details
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Quick Details
-
Size:
-
10 inch
-
Inside diameter:
-
300mm
-
Outer diameter:
-
350mm
-
Thickness:
-
1.5+0.1mm
-
Color:
-
Silver
-
Materials:
-
Stainless Steel
-
Surface:
-
Lapping
-
OEM&ODM:
-
Avaliable
-
Packaging:
-
PE bags , blister bags , Export cartons
Quick Details
-
Place of Origin:
-
Liaoning, China
-
Brand Name:
-
DaJin
-
Model Number:
-
DJ-10BA
-
Size:
-
10 inch
-
Inside diameter:
-
300mm
-
Outer diameter:
-
350mm
-
Thickness:
-
1.5+0.1mm
-
Color:
-
Silver
-
Materials:
-
Stainless Steel
-
Surface:
-
Lapping
-
OEM&ODM:
-
Avaliable
-
Packaging:
-
PE bags , blister bags , Export cartons
Details Images
![](https://cdn.bestsuppliers.com/seo_products_img/dajinjixie/0261dbf88a503a0989f44f22fb5506c7.jpg!/rotate/180)
![](https://cdn.bestsuppliers.com/seo_products_img/dajinjixie/b3635efedd003dc09cf74afaf9a79592.jpg!/rotate/180)
![](https://cdn.bestsuppliers.com/seo_products_img/dajinjixie/a32612a282903a2d948eb36591fb71df.jpg!/rotate/180)
Products Description
![](https://cdn.bestsuppliers.com/seo_products_img/dajinjixie/72c7d0c7057d370dbba09869504a0312.jpg!/rotate/180)
10 inch stainless Steel wafer frame ring
The wafer frame ring can be very good to fix the wafer inside the frame box, so that the turnover of the wafer during the production process will not hurt the expensive wafer, scratch and other phenomena.
PRODUCT ADVANTAGE
MODULAR SIZE
HIGH HARDNESS
RESISTANCE
SMOOTHNESSHIGH HARDNESS
SUPERIOR BENDING CORROSION
STRONG SCRATCH RESISTANCE
HIGH CUTTING ACCURACY
KEEP CLEAN AND BEAUTIFUL
WEAR RESISTANCE
HIGH CUTTING ACCURACY
MODULAR SIZE
Product Paramenters
No
|
Item
|
Data
|
1
|
Product NamePower
|
10 inch stainless Steel wafer frame ring
|
2
|
Brand Name
|
DaJin
|
3
|
Model Number
|
DJ-10HL
|
4
|
Size
|
10 inch
|
5
|
Inside diameter
|
300mm
|
6
|
Outer diameter
|
350mm
|
7
|
Thickness
|
1.5±0.1mm
|
8
|
Color
|
Silver
|
9
|
Materials
|
Stainless Steel
|
10
|
Surface
|
Wire drawing
|
11
|
Packaging
|
PE bags , blister bags , Export cartons
|
12
|
OEM/ODM
|
Available
|
Features of Wafer Metal Frame
1. Anti-folding, anti-corrosion and anti-scratching Flatness : ≤0.2mm hardness : 50-55HRC.
2. Heat treatment process Wafer ring has good resistance to rebound after heat treatment.
3. Precision machining precision Wafer Iron Ring using laser cutting machine, cutting error is small.
4. Compatible with various packaging devices Compatible with frame processing device (Disco, TSK, ADT, etc.)
5. Quality assurance durable.
Production Process
Laser cutting with high accuracy
Advanced laser cutting machine is with high cutting accuracy, shape tolerance according to GB/T1184-K, size tolerance according to GB/T1804-M standard processing molding.
Heat treatment process of selected raw material
SUS420J2 imported material, with good corrosion resistance, heat resistance. The product has good resistance to rebound after heat treatment.
Surface electropolishing treatment
The surface is polished, the surface flatness can reach above ±0.01mm, the finish RX value can reach above 0.08um, can keep clean and beautiful for a long time.
Special requirements for marking processing.
Customized special logo according to customer needs.
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