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10 Inch Metal Frame Ring Assembly for Semiconductor Production
10 Inch Metal Frame Ring Assembly for Semiconductor Production
10 Inch Metal Frame Ring Assembly for Semiconductor Production
10 Inch Metal Frame Ring Assembly for Semiconductor Production
10 Inch Metal Frame Ring Assembly for Semiconductor Production
10 Inch Metal Frame Ring Assembly for Semiconductor Production
10 Inch Metal Frame Ring Assembly for Semiconductor Production
10 Inch Metal Frame Ring Assembly for Semiconductor Production

10 Inch Metal Frame Ring Assembly for Semiconductor Production

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≥1 Pieces
US $7.5
≥500 Pieces
US $7
≥1000 Pieces
US $6.5
≥10000 Pieces
US $6
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Quick Details

Size:
10 inch
Inside diameter:
300mm
Outer diameter:
350mm
Thickness:
1.5+0.1mm
Color:
Silver
Materials:
Stainless Steel
Surface:
Lapping
OEM&ODM:
Avaliable
Packaging:
PE bags , blister bags , Export cartons

Quick Details

Place of Origin:
Liaoning, China
Brand Name:
DaJin
Model Number:
DJ-10BA
Size:
10 inch
Inside diameter:
300mm
Outer diameter:
350mm
Thickness:
1.5+0.1mm
Color:
Silver
Materials:
Stainless Steel
Surface:
Lapping
OEM&ODM:
Avaliable
Packaging:
PE bags , blister bags , Export cartons
Details Images
Products Description
10 inch stainless Steel wafer frame ring
The wafer frame ring can be very good to fix the wafer inside the frame box, so that the turnover of the wafer during the production process will not hurt the expensive wafer, scratch and other phenomena.
PRODUCT ADVANTAGE


MODULAR SIZE
HIGH HARDNESS
RESISTANCE
SMOOTHNESSHIGH HARDNESS
SUPERIOR BENDING CORROSION
STRONG SCRATCH RESISTANCE
HIGH CUTTING ACCURACY
KEEP CLEAN AND BEAUTIFUL


WEAR RESISTANCE
HIGH CUTTING ACCURACY
MODULAR SIZE
Product Paramenters
No
Item
Data
1
Product NamePower
10 inch stainless Steel wafer frame ring
2
Brand Name
DaJin
3
Model Number
DJ-10HL
4
Size
10 inch
5
Inside diameter
300mm
6
Outer diameter
350mm
7
Thickness
1.5±0.1mm
8
Color
Silver
9
Materials
Stainless Steel
10
Surface
Wire drawing
11
Packaging
PE bags , blister bags , Export cartons
12
OEM/ODM
Available

Features of Wafer Metal Frame

1. Anti-folding, anti-corrosion and anti-scratching Flatness : ≤0.2mm hardness : 50-55HRC.
2. Heat treatment process Wafer ring has good resistance to rebound after heat treatment.
3. Precision machining precision Wafer Iron Ring using laser cutting machine, cutting error is small.
4. Compatible with various packaging devices Compatible with frame processing device (Disco, TSK, ADT, etc.)
5. Quality assurance durable.
Production Process

Laser cutting with high accuracy

Advanced laser cutting machine is with high cutting accuracy, shape tolerance according to GB/T1184-K, size tolerance according to GB/T1804-M standard processing molding.

Heat treatment process of selected raw material

SUS420J2 imported material, with good corrosion resistance, heat resistance. The product has good resistance to rebound after heat treatment.

Surface electropolishing treatment

The surface is polished, the surface flatness can reach above ±0.01mm, the finish RX value can reach above 0.08um, can keep clean and beautiful for a long time.

Special requirements for marking processing.

Customized special logo according to customer needs.
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