- Product Details
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Quick Details
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Type:
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THERMAL PAD
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Product name:
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Thermal silica pads
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Brand:
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itousen
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color:
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blue, pink ,white , grey,blue customized
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Size:
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workable die cutting,customized
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Sample:
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free sample
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Advantage:
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good conductivity non-corrosive
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Certification:
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ROHS
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Application condition:
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high or low temperature
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Thickness:
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0.3-14mm
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Shape:
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customized shape
Quick Details
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Place of Origin:
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Guangdong, China
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Brand Name:
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TOUSEN
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Model Number:
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TSP
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Type:
-
THERMAL PAD
-
Product name:
-
Thermal silica pads
-
Brand:
-
itousen
-
color:
-
blue, pink ,white , grey,blue customized
-
Size:
-
workable die cutting,customized
-
Sample:
-
free sample
-
Advantage:
-
good conductivity non-corrosive
-
Certification:
-
ROHS
-
Application condition:
-
high or low temperature
-
Thickness:
-
0.3-14mm
-
Shape:
-
customized shape
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Products Description
Please contact us with pads size , thickness and conductivity before your place orders . Thank you !
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed
rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact; they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become soft and are able to fill gaps at higher temperatures.
rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact; they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become soft and are able to fill gaps at higher temperatures.
Features :
* The product has high thermal conductivity
* It has bettter flexibility and compressibility
* This product is non-corrosive
* It is resistant to high temperatures
* The thermal silica pad is effectively insulated
* It is compatible for CPU, graphics card and LED chip cooling
Applications:
* High thermal conductivity module
* new energy vehicles
* Microprocessors, memory chips and graphics processors
* Network communication equipment
* Car equipment, charger
* High-speed hard disk drive
* new energy vehicles
* Microprocessors, memory chips and graphics processors
* Network communication equipment
* Car equipment, charger
* High-speed hard disk drive
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