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Heat/thermal conductive Adhesive transparent Silicone Encapsulate for Solar Cells/Electronics Encapsulation
Heat/thermal conductive Adhesive transparent Silicone Encapsulate for Solar Cells/Electronics Encapsulation
Heat/thermal conductive Adhesive transparent Silicone Encapsulate for Solar Cells/Electronics Encapsulation
Heat/thermal conductive Adhesive transparent Silicone Encapsulate for Solar Cells/Electronics Encapsulation
Heat/thermal conductive Adhesive transparent Silicone Encapsulate for Solar Cells/Electronics Encapsulation
Heat/thermal conductive Adhesive transparent Silicone Encapsulate for Solar Cells/Electronics Encapsulation
Heat/thermal conductive Adhesive transparent Silicone Encapsulate for Solar Cells/Electronics Encapsulation
Heat/thermal conductive Adhesive transparent Silicone Encapsulate for Solar Cells/Electronics Encapsulation

Heat/thermal conductive Adhesive transparent Silicone Encapsulate for Solar Cells/Electronics Encapsulation

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≥1 Kilograms
US $6.9
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Quick Details

Product name:
Raw Material Silicone Rubber
VISCOSITY (Mpa.s):
6000-8000
Mixing ratio:
1:1/10:1
Application:
Liquid Silicone
Hardness:
15 Shore
Shelf life:
12 Months
Sample service:
Sample Test
Color:
Adjustable

Quick Details

Place of Origin:
Huizhou
Brand Name:
Jiajing Hong Silicone
Model Number:
9405
Product name:
Raw Material Silicone Rubber
VISCOSITY (Mpa.s):
6000-8000
Mixing ratio:
1:1/10:1
Application:
Liquid Silicone
Hardness:
15 Shore
Shelf life:
12 Months
Sample service:
Sample Test
Color:
Adjustable
Products Description
Electronic potting silicone
Electronic potting silicone is a two-component room temperature vulcanization silicone material, with flame retardant and thermal conductivity, can be cured at room temperature or heating. It is divided into condensation type electronic potting adhesive and additive electronic potting silicone.

Product Usage

* Suitable for insulation, waterproofing, fixing and flame retardant of electronic accessories and DC modules.

* Application to PC (Polycarbonate), PP, ABS, PVC and other materials and metal surfaces.

* High power electronic components, power boxes, etc.

* Potting protection for module power supplies and circuit boards with high heat dissipation and temperature resistance requirements.
Product Paramenters
Product Model
H9065
H9055
H9045
H9035
Components
A B
A B
A B
A B
Appearance
Dark gray White
Dark gray White
Dark gray White
Dark gray White
Before vulcanization
Dynamic viscosity (mPas)
5000±2000
5000±2000
3500±2000
5000±2000
A B two components mixing volume ratio
1:1
1:1
1:1
1:1
Operating Performance
Operation time(min/25℃
60-120
60-120
60-120
60-120
Vulcanization time(H,25℃)
8
8
8
8
Vulcanization time (min/80℃)
30
30
30
30
Hardness (Shore Aº)
65±3
55±3
45±3
35±3
Line rise coefficient [M/(m.K)
≤2.2×104
≤2.2×104
≤2.2×104
≤2.2×104
After vulcanization
Thermal conductivity [W/(M.k)
≥0.8
≥0.8
≥0.8
≥0.8
Dielectric insulation (KV/mm)
≥25
≥25
≥25
≥25
Dielectric constant (1.2MHZ)
3.0-3.3
3.0-3.3
3.0-3.3
3.0-3.3
Volume resistivity(Ω.CM)
≥1.0×1016
≥1.0×1016
≥1.0×1016
≥1.0×1016
Flame retardancy
UL94-V1
UL94-V1
UL94-V1
UL94-V1
Product packaging
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