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HY510 30g Heat Sink Thermal Silicone Compound Thermal Paste silver CPU processor Conductive thermal paste
HY510 30g Heat Sink Thermal Silicone Compound Thermal Paste silver CPU processor Conductive thermal paste
HY510 30g Heat Sink Thermal Silicone Compound Thermal Paste silver CPU processor Conductive thermal paste
HY510 30g Heat Sink Thermal Silicone Compound Thermal Paste silver CPU processor Conductive thermal paste
HY510 30g Heat Sink Thermal Silicone Compound Thermal Paste silver CPU processor Conductive thermal paste
HY510 30g Heat Sink Thermal Silicone Compound Thermal Paste silver CPU processor Conductive thermal paste
HY510 30g Heat Sink Thermal Silicone Compound Thermal Paste silver CPU processor Conductive thermal paste
HY510 30g Heat Sink Thermal Silicone Compound Thermal Paste silver CPU processor Conductive thermal paste

HY510 30g Heat Sink Thermal Silicone Compound Thermal Paste silver CPU processor Conductive thermal paste

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≥125 Pieces
US $0.35
≥250 Pieces
US $0.28
≥5000 Pieces
US $0.25
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Quick Details

Place of Origin:
Guangdong, China
Model Number:
HY510
Type:
Liquid Glue
Color:
grey
Thermal conductivity:
>1.93W/m-K
Gravity:
>2.0 g/cm3
Operation temperature:
-30--300 C
Thermal Impedance:
<0.225°C-in2/W
Operation Temperature(Peak):
-30~300°C
Moment Bore Temperature:
-50~300°C

Quick Details

CAS No.:
7085-85-0
Other Names:
Silicone Sealant
EINECS No.:
230-391-5
Place of Origin:
Guangdong, China
Model Number:
HY510
Type:
Liquid Glue
Color:
grey
Thermal conductivity:
>1.93W/m-K
Gravity:
>2.0 g/cm3
Operation temperature:
-30--300 C
Thermal Impedance:
<0.225°C-in2/W
Operation Temperature(Peak):
-30~300°C
Moment Bore Temperature:
-50~300°C
Product Description
Items:HY510
Thermal conductivity:>1.93W/m-K
Thermal Impedance:<0.225°C-in2/W
Gravity:>2.0g/cm3
Viscosity:1000
Thixotropic Index:380±10 1/10mm
Operation Temperature(Peak):-30~300°C
Moment Bore Temperature:-50~300°C
Introduction:
Thermal Grease Paste, Help Your Electrical Appliance To Thermal Conductivity And Heat Dissipation,
To Ensure That The Electronic Instruments, Meters And Other Electrical Performance Stability.
Features:
1.High Grade Stability And Reliability.
2.Apply to CPU, VGA, Chipset, Radiator And Other PC Components.
3.Helps Disperse The Heat From CPU To Heatsink Effectively.
4.Low Thermal Resistance And High Conductivity For Superior Heat Transfer.
5.High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive.6.Compliance with RoHS REACH PFOS requirements
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