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Quick Details
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Brand Name:
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XWS
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Supplier Type:
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Factory supply directly, factory
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Product name:
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Pcb Manufacturer
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Max. Board Size:
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23 * 25"(580mm*900mm)
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Solder Mask Color:
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Green/Yellow/Black/White/Red/Blue
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Hole tolerance:
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PTH: ±0.076 NPTH: ±0.05
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Type of Assembly:
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SMT, Thru-hole, Cable assembly, Wire Harness
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Special requirements:
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Buried and blind vias + controlled impedance +BGA
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Profiling:
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Punching, Routing, V-CUT, Beveling
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Testing:
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Flying Probe Test, X-ray Inspection AOI Test
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Reference Standard:
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IPC-A-600G Class 2, Class 3
Quick Details
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Model Number:
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XWS-6070
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Type:
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Multilayer pcb
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Place of Origin:
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Guangdong, China
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Brand Name:
-
XWS
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Supplier Type:
-
Factory supply directly, factory
-
Product name:
-
Pcb Manufacturer
-
Max. Board Size:
-
23 * 25"(580mm*900mm)
-
Solder Mask Color:
-
Green/Yellow/Black/White/Red/Blue
-
Hole tolerance:
-
PTH: ±0.076 NPTH: ±0.05
-
Type of Assembly:
-
SMT, Thru-hole, Cable assembly, Wire Harness
-
Special requirements:
-
Buried and blind vias + controlled impedance +BGA
-
Profiling:
-
Punching, Routing, V-CUT, Beveling
-
Testing:
-
Flying Probe Test, X-ray Inspection AOI Test
-
Reference Standard:
-
IPC-A-600G Class 2, Class 3
This is Sophie of XWS, which can provide one-stop printed circuit board assembly services.
Please contact us
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PCB Assembly SMT & DIP manufacturing Capabilities: |
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Quantity |
Prototype, Low, Medium, High Volume PCB Assembly, |
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Type of Assembly |
SMT, Thru-hole, Cable assembly, Wire Harness |
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Min. IC Pitch |
0.30mm |
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Foot Pin |
SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
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Min. Chip Placement |
1005 |
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Max. PCB Size |
410 x 600mm |
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Min. PCB Thickness |
0.35mm |
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Maximum BGA Size |
74 x 74mm |
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BGA Ball Pitch |
1mm ~ 3mm |
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BGA Ball Diameter |
0.4mm ~ 1mm |
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QFP Lead Pitch |
0.38mm ~ 2.54mm |
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Solder Type |
Water Soluble Solder, Lead-Free, Wave soldering |
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Components |
Passive Down to 0201 size |
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BGA and VFBGA |
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Leadless Chip Carriers/CSP/QFN |
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Double-sided SMT Assembly |
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Fine Pitch to 0.8mils |
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BGA Repair and Reball |
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Part Removal and Replacement |
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File Format |
Bill of Materials |
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Gerber files |
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Pick-N-Place file |
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Types of Service |
Turn-key, Partial turn-key or consignment, pilot run |
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Component packaging |
Cut Tape, Tube ,Reels, Loose Parts |
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Turn Time |
Same day service to 15 days service |
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Programing |
Hex file or bin file firmware. |
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Testing |
Flying Probe Test, X-ray Inspection AOI Test |
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Package |
Anti-static Bubble Bag & Carton |
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PCB assembly process |
IQC for incoming materials checking----Material baking----SMT----- Semi-Products Testing & QC ---DIP parts -- IPQC--- Wave Soldering--Semi-Products Testing & QC-----Assembling-----ICT or Xray-----100% Function Testing-----Reliabiilty Testing (burn-testing) - Package - Shiping |
