- Product Details
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Quick Details
-
voltage:
-
380V
-
Certification:
-
CE, CE Certification
-
Usage:
-
BGA Rework
-
Product type:
-
Manual Bga Rework Station
-
COLOR:
-
White blue
-
weight:
-
128kg
-
Model:
-
ZM-R730
-
SIZE:
-
L1000*W840*H950MM
-
Weight:
-
128KG
Quick Details
-
Place of Origin:
-
China
-
After-sales Service Provided:
-
Engineers available to service machinery overseas, Field maintenance and repair service, Video technical support, Online support
-
usage:
-
repair mobile phone, xbox, ps, laptop
-
voltage:
-
380V
-
Certification:
-
CE, CE Certification
-
Usage:
-
BGA Rework
-
Product type:
-
Manual Bga Rework Station
-
COLOR:
-
White blue
-
weight:
-
128kg
-
Model:
-
ZM-R730
-
SIZE:
-
L1000*W840*H950MM
-
Weight:
-
128KG
Hot Air Low Price BGA Rework Station ZM-R730 for repair larger pcb board
Zhuomao BGA Rework Station has widely applied to repair different ranges of electronics products. From low level chipsets repair to high level chipsets repair.
The main user is
repairing shops
and
factory
to provide the after-sales service and PCBA PCB’S rework.
What kinds of components of the PCBA motherboard can be repaired by the ZM-R730 BGA rework station?
BGA, QGN, CSP, POP, QFN, Micro SMD etc.
Application of ZM-R730 bga rework station
→ Laptop / Notebook/ Computer motherboard repair.
→
Playstation / XBOX 360 and other game console repair.
→
Mobile phone motherboard repair, such as Samsung or Iphone 4/ 4s / 5 / 5s 6/ 6s 7/ 7s/ 8/ x motherboard repair.
→
TV / Video / ipad mainboard repai.
→
SMD/ QFP / IC BGA rework etc.
We have different ranges of bga rework station for your selection.
We can customize the BGA LED SMD rework station according to your requirements.
Specification of the ZM-R730 BGA rework station:
1. Power: AC 220V±10 % 50/60 Hz
2. Total Power: Max 7500W
3. Heater power: Top heater 1200 W Bottom heater 1200 W IR heater 4800 W
4. Electrical materials : Intelligence Programmable controller, support connect computer
5. Temperature control: K-type thermocouple (Closed Loop), independence temperature control, accuracy within±1 ℃
6. Positioning: V-groove, PCB support
7. PCB size: Max 645×520 mm Min 6×6 mm
8. BGA chip: Max 80×80mm Min 3×3 mm
How to rework the BGA chip from motherboard?
Repair steps:
1.
Remove
the BGA chip from mother board –we call it desoldering
2.
Clean
Pad
3.
Reballing
or
replace
a new BGA chip directly
4.
Alignment/Positioning
– use CCD optical camera
5.
Mount
the BGA chip, then automatically
soldering
- we called soldering